Assembly of electronic components
AssigneeSilverbrook Research Pty Ltd
InventorsKia Silverbrook, Laval Chung-Long-Shan, Kiangkai Tankongchumruskul
Life of this patent
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Abstract
An electronic component assembly that has a supporting structure, an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other and, wire bonds electrically connecting the contact pads to the conductors. An intermediate portion of each of the wire bonds is adhered to the die attach film to lower the profile of the wire bond arcs.
Claims14
An electronic component assembly comprising:
- a supporting structure;
- an integrated circuit die with a plurality of contacts pads;
- a printed circuit board with a plurality of conductors, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other;
- and,
- wire bonds electrically connecting the contact pads to the conductors;
- wherein,
- an intermediate portion of each of the wire bonds is adhered to the die attach film.
An electronic component assembly according to claim 10 wherein the contact pads are between 2 mm and 3 mm from the corresponding conductors on the PCB.
Dependencies are inferred from the claim text.