Flexible printed wiring board and semiconductor device employing the same
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsKatsuhiko HAYASHI, Tatsuo KATAOKA
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Abstract
Objects of the present invention is to provide a flexible printed wiring board which has a simple structure, which can be produced at low cost, and which can effectively dissipate heat generated by semiconductor chips, and to provide a semiconductor device employing the flexible printed wiring board. The flexible printed wiring board of the invention has an insulating substrate, and a wiring pattern formed of a conductor layer and provided on one surface of the insulating substrate, wherein the wiring pattern includes inner leads for mounting a semiconductor chip and outer leads for input and output wire connection, and a metal layer is adhered to the wiring pattern via an insulating adhesion layer.
Claims9
A flexible printed wiring board comprising:
- an insulating substrate,
- a wiring pattern formed of a conductor layer and provided on one surface of the insulating substrate,
- an insulating adhesion layer, and
- a metal layer,
- wherein the wiring pattern includes inner leads for mounting a semiconductor chip and outer leads for input and output wire connection, and the metal layer is adhered to the wiring pattern via the insulating adhesion layer.
Dependencies are inferred from the claim text.