Integrated circuit packaging system with package underfill and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• providing a sacrificial carrier assembly having a stack interconnector thereover;
• mounting an integrated circuit having a connector over the sacrificial carrier assembly with the connector over the stack interconnector;
• dispensing an underfill material between the sacrificial carrier assembly and the integrated circuit with the underfill material substantially free of a void;
• encapsulating the integrated circuit over the sacrificial carrier assembly and the underfill material;
• exposing the stack interconnector by removing the sacrificial carrier assembly;
• forming a base array having a routing trace and a film layer over the underfill material and the stack interconnector;
• forming a base by singulation of the base array;
• and
• attaching a system interconnector to the routing trace or the film layer of the base.

An integrated circuit packaging system comprising:

• a stack interconnector;
• an integrated circuit having a connector over the stack interconnector;
• a base, having a first side and a second side, attached to the stack interconnector with the first side facing the stack interconnector;
• an underfill substantially free of a void between the base and the integrated circuit;
• an encapsulation over the integrated circuit;
• and
• a system interconnector attached to the second side.