Integrated circuit package system with multiple device units and method for manufacturing thereof

A method for manufacturing an integrated circuit package system comprising:

• forming a first device unit, having first external interconnects arranged along a perimeter of the first device unit, and a second device unit, having second external interconnects arranged along a perimeter of the second device unit, in an array configuration;
• mounting an integrated circuit die over the first device unit;
• connecting the integrated circuit die and the first external interconnects;
• mounting a device over the second device unit;
• connecting the device and the second external interconnects;
• encapsulating with an encapsulation covering the integrated circuit die, the device, the first device unit, and the second device unit with both the first external interconnects and the second external interconnects partially exposed;
• and
• forming a partial encapsulation cut in the encapsulation electrically isolating the first external interconnects and the second electrical interconnects.

An integrated circuit package system comprising:

• a first device unit having first external interconnects along a perimeter of the first device unit;
• a second device unit, having second external interconnects along the perimeter of the second device unit, in an array configuration with the first device unit;
• an integrated circuit die over the first device unit and connected with the first external interconnects;
• and
• an encapsulation, having a partial cut, over the integrated circuit die, the device, the first device unit, and the second device unit with both the first external interconnects and the second external interconnects partially exposed with the partial cut electrically isolating the first external interconnects and the second electrical interconnects.