Semiconductor device and manufacturing method thereof
AssigneeElpida Memory, Inc.
InventorSHINGO UJIHARA
Life of this patent
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Abstract
A semiconductor device has a first insulation film defining a plurality of contact holes arranged along a predetermined direction. A plurality of first contact plugs is respectively formed in the contact holes. A second insulation film is formed on the first insulation film and defining an opening to expose a predetermined region of the first insulation film including a region where the first contact plugs are formed. A plurality of interconnections are formed to extend across the opening and to be in contact with top surfaces of the first contact plugs, respectively.
Claims20
A semiconductor device comprising:
- a first interlayer film defining a plurality of contact holes arranged along a first direction;
- a plurality of contact plugs filled in the contact holes, respectively;
- a second interlayer film formed on the first interlayer film and having an opening to expose a predetermined region of the first interlayer film including a region where the contact plugs are disposed;
- and
- a plurality of interconnections formed to extend across the opening and to be in contact with top surfaces of the contact plugs, respectively, wherein each interconnection extends in a second direction being crossed to the first direction.
A manufacturing method of a semiconductor device, comprising:
- forming a plurality of contact plugs arranged in a first direction in a first interlayer film;
- forming a second interlayer film on the first interlayer film and on the contact plugs;
- forming an opening in the second interlayer film to expose a predetermined region of the first interlayer film including a region where the contact plugs are formed;
- forming a interconnection conductive film on the second interlayer film to bury the opening by the interconnection conductive film;
- and
- patterning the interconnection conductive film to form a plurality of interconnections which are in contact with the contact plugs, respectively, wherein each interconnection extends in the second direction being crossed to the first direction.
Dependencies are inferred from the claim text.