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US 2010/0244270 A1Published application
Manufacturing method of semiconductor device and semiconductor device
AssigneeSony Corporation
InventorsHiroshi Asami, Masaki Hatano, Akihiro Morimoto
Life of this patent
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Abstract
A semiconductor device includes: a component substrate of a semiconductor device; electrode pads provided on one surface of the component substrate; a support plate material reinforcing the component substrate; via holes made in the support plate material; a conducting material filled in the via holes; and a joining member interposed between the electrode pads and the conducting material and joining the component substrate and the support plate material.
Claims5
A manufacturing method of a semiconductor device comprising the steps of:
- forming a component substrate of a semiconductor device provided with electrode pads on one surface thereof;
- making via holes in a support plate material reinforcing the component substrate and filling a conducting material in the via holes;
- and
- joining the component substrate and the support plate material in such a manner that the electrode pads on the component substrate and the conducting material filled in the via holes in the support plate material are electrically connected to each other.
1 more element
A semiconductor device comprising:
- a component substrate of a semiconductor device;
- electrode pads provided on one surface of the component substrate;
- a support plate material reinforcing the component substrate;
- via holes made in the support plate material;
- a conducting material filled in the via holes;
- and
- a joining member interposed between the electrode pads and the conducting material and joining the component substrate and the support plate material.
4 more elements
Dependencies are inferred from the claim text.