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US 2010/0244268 A1Published application
Apparatus, system, and method for wireless connection in integrated circuit packages
AssigneeIntel Corporation
InventorsJiamiao Tang, Henry Xu, Shinichi Sakamoto
Life of this patent
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Abstract
Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
Claims21
An apparatus comprising:
- a support including a support surface and a support bond pad on the support surface;
- a first die including a die surface and a die bond pad on the die surface;
- a dielectric layer located outside the die, the dielectric layer including a via and groove combination coupled to the die bond pad and the support bond pad;
- and
- a connection coupled to the die bond pad and the support bond pad, wherein the connection includes at least one conductive segment inside the via and groove combination.
2 more elements
A system comprising:
- an integrated circuit package including:
- a support including a support surface and a support bond pad on the support surface;
- a first die including a die surface and a die bond pad on the die surface;
- a dielectric layer located outside the die, the die electric layer including a via and groove combination coupled to the die bond pad and the support bond pad;
- and
- a connection coupled to the die bond pad and the support bond pad, wherein connection includes at least one conductive segment inside the via and groove combination;
- and
- a dynamic random access memory device coupled to the support bond pad.
5 more elements
A method comprising:
- forming a dielectric layer over at least one die and over a portion of a support attached to the die;
- forming plurality of via and groove combinations in the dielectric layer, wherein each of the via and groove combinations provides an access to a plurality of die bond pads on the die and an access to a plurality of support bond pads on the support;
- and
- forming a plurality of connections in the via and groove combinations, wherein each of the connections is coupled to one of die bond pads and one of the support bond pads.
1 more element
Dependencies are inferred from the claim text.