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US 2010/0244266 A1Published application
Metallic bonding structure for copper and solder
OwnerJenq-Gong Duh, Chi-Yang Yuinventors
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Abstract
The present invention discloses a metallic bonding structure for copper and solder, which applies to connect at least one electronic element. The metallic bonding structure comprises at least one copper-based member and at least one zinc bonding member. The copper-based members are arranged on the electronic element through at least one solder member. The zinc bonding members are arranged between the copper-based members and the solder members. The solder members are tin-based solder bumps.
Claims11
A metallic bonding structure for copper and solder, which applies to connect at least one electronic element, comprising:
- at least one copper-based member arranged on said electronic element, wherein at least one solder member is used to solder said electronic element;
- and
- at least one zinc bonding member arranged between said copper-based member and said solder member.
Dependencies are inferred from the claim text.