Wiring structures
AssigneeSamsung Electronics Co., Ltd.
InventorKyoung-Woo Lee
Life of this patent
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Abstract
A wiring structure includes a conductive pattern on a substrate, a first insulation layer pattern between adjacent conductive patterns and a second insulation layer pattern on the first insulation layer pattern. The first insulation layer pattern is separated from the conductive pattern by a first distance to provide a first air gap. The second insulation layer pattern is spaced apart from the conductive pattern by a second distance substantially smaller than the first distance to provide a second air gap. The wiring structure may have a reduced parasitic capacitance while simplifying processes for forming the wiring structure.
Claims12
A wiring structure comprising:
- a conductive pattern on a substrate;
- a first insulation layer pattern between adjacent conductive patterns and separated from the conductive pattern by a first distance to provide a first air gap between the conductive pattern and the first insulation layer pattern;
- and
- a second insulation layer pattern on the first insulation layer pattern and separated from the conductive pattern by a second distance smaller than the first distance to provide a second air gap between the conductive pattern and the second insulation layer pattern.
12-20. (canceled)
Dependencies are inferred from the claim text.