Semiconductor package
AssigneeSTMicroelectronics (Grenoble) SAS
InventorsRomain Coffy, Jean-François Sauty
Life of this patent
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Abstract
A semiconductor package includes a semiconductor die attached to a support having electrically conductive paths, the semiconductor die having a bond-pad electrically connected to the electrically a conductive path on the support by a wire-bond of a first metallic composition, the wire-bond and the bond-pad being coated with a protection layer of a second metallic composition.
Claims13
A semiconductor package comprising a semiconductor die attached to a support having electrically conductive paths, said semiconductor die having a bond-pad electrically connected to the electrically a conductive path on said support by a wire-bond of 99% pure copper,
- wherein said wire-bond and said bond-pad are coated with a protection layer of a second metallic composition.
Dependencies are inferred from the claim text.