Electronic component with mechanically decoupled ball connections

A method of making an electronic component including at least one chip and/or one support, the chip configured to be transferred onto the support and connected, at least one connection location of the chip, to at least one connection location of the support through at least one ball, the method comprising:

• making at least one trench in at least one first layer, communicating with at least part of a sacrificial layer placed in contact with the first layer and partly surrounding a portion of the first layer such that at least one zone of the layer connects the portion of the layer to a rest of the layer;
• eliminating part of the sacrificial layer, forming at least one buried cavity and arranged under at least the portion of the first layer corresponding to the connection location of the chip and/or the connection location of the support;
• and
• the trench, cavity, and the zone of the layer forming mechanical decoupling means of the connection location of the chip and/or the connection location of the support from the chip and/or from the support, the zone of the layer being made from at least one non-metallic material.