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US 2010/0244243 A1Published application
Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorFumihiko Eya
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Abstract
A semiconductor device has a flexible substrate which can be folded U-shape, and an outer surface of the flexible substrate being provided concave-convex portions for heat radiation. The semiconductor device also has a semiconductor chip which is mounted on an inner surface of the flexible substrate, and the chip being electronically connected with the flexible substrate.
Claims20
A semiconductor device comprising:
- a flexible substrate which can be folded U-shape, an outer surface of the flexible substrate being provided concave-convex portions for heat radiation;
- and
- a semiconductor chip which is mounted on an inner surface of the flexible substrate, the chip being electronically connected with the flexible substrate.
A semiconductor device comprising:
- a flexible substrate which can be folded U-shape, the flexible substrate being provided through holes for heat radiation;
- and
- a semiconductor chip which is mounted on an inner surface of the flexible substrate, the chip being electronically connected with the flexible substrate.
Dependencies are inferred from the claim text.