Stackable electronic package and method of making same

A method comprising:

• forming a first chip apparatus comprising:
• coupling a first die and a first plurality of feed-thru pads to a first side of a first flex layer, the first die comprising a plurality of electrical pads;
• coupling a first plurality of slugs to the first plurality of feed-thru pads;
• encapsulating the first die, the first plurality of feed-thru pads, and the first plurality of slugs in a first encapsulant;
• removing a portion of the first encapsulant to expose the first plurality of slugs;
• and
• removing the first plurality of slugs from the first encapsulant to form a first plurality of cavities in the first encapsulant, to expose a portion of the first plurality of feed-thru pads coupled to the first side of the first flex layer, and to reduce a rigidity of the first portion of the first plurality of feed-thru pads.

A method comprising:

• forming a first chip package layer comprising:
• coupling a first die to a first flex layer;
• coupling a first plurality of feed-thru pads to the first flex layer;
• coupling a first plurality of sacrificial material bodies to the first plurality of feed-thru pads;
• applying a first encapsulant to the first flex layer, to the first die, to the first plurality of feed-thru pads, and to the first plurality of sacrificial material bodies;
• curing the first encapsulant;
• grinding a portion of the encapsulant to reveal the first plurality of sacrificial material bodies;
• and
• expunging the first plurality of sacrificial material bodies from the encapsulant to create a plurality of chambers in the encapsulant and to reveal the first plurality of feed-thru pads.