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US 2010/0244236 A1Published application
Integrated circuit packaging system with heat spreader and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsJaEun Yun, Jong Wook Ju, WonJun Ko, Hye Ran Lee
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate; mounting an integrated circuit die on the package substrate; and attaching a heat spreader assembly, having a thermal adhesive layer formed therein, to the package substrate and the integrated circuit die.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a package substrate;
- mounting an integrated circuit die on the package substrate;
- and
- attaching a heat spreader assembly, having a thermal adhesive layer formed therein, to the package substrate and the integrated circuit die.
1 more element
A method of manufacture of an integrated circuit packaging system comprising:
- providing a package substrate having a component side and a system side;
- mounting an integrated circuit die on the component side of the package substrate;
- and
- attaching a heat spreader assembly, having a thermal adhesive layer formed therein, to the component side of the package substrate and the integrated circuit die.
1 more element
An integrated circuit packaging system comprising:
- a package substrate;
- an integrated circuit die mounted on the package substrate;
- and
- a heat spreader assembly, with a thermal adhesive layer therein, attached to the package substrate and the integrated circuit die.
1 more element
Dependencies are inferred from the claim text.