Integrated circuit package and method of making same
AssigneeGeneral Electric Company
InventorsChristopher James Kapusta, James Sabatini
Life of this patent
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Abstract
An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side. The package also includes a die having an active surface affixed to a contact location of the first side of the dielectric film absent a layer of adhesive therebetween that is distinct from a material of the dielectric film. A die stud is affixed to the active surface of the die and extends through the dielectric film to an interconnect location of the second side of the dielectric film, and a via is formed through the dielectric film by the die stud.
Claims26
An apparatus comprising:
- a first dielectric layer comprising a dielectric film having a first side and a second side;
- a die having an active surface affixed to a contact location of the first side of the dielectric film absent a layer of adhesive therebetween that is distinct from a material of the dielectric film;
- a die stud affixed to the active surface of the die and extending through the dielectric film to an interconnect location of the second side of the dielectric film;
- and
- wherein a via is formed through the dielectric film by the die stud.
A method of fabricating an integrated circuit (IC) package comprising:
- providing a dielectric film;
- affixing an electrical component to a first surface of the dielectric film via an adhesive property of the dielectric film by pressing the electrical component into the dielectric film such that an attachment stud of the electrical component through the dielectric film;
- and
- curing the dielectric film after pressing the electrical component thereinto.
An apparatus comprising:
- a dielectric film having a first side and a second side;
- a plurality of components affixed to the first side of the dielectric film via an adhesive property of the dielectric film and absent a layer of adhesive between the plurality of components and the dielectric film that is distinct from a property of the dielectric film;
- at least one attachment stud affixed to a contact pad of each of the plurality of components;
- and
- wherein a via is formed through the dielectric film by the at least one attachment stud.
Dependencies are inferred from the claim text.