Semiconductor device and method of manufacturing same

A semiconductor device comprising:

• a semiconductor chip including a plurality of electrode pads arranged on one surface thereof;
• a wiring board disposed closer to the other surface of said semiconductor chip, said wiring board having one surface spaced apart from and opposite to the other surface of said semiconductor chip;
• a throughhole pierced to extend through said wiring board;
• a plurality of connections arranged on the one surface of said wiring board in correspondence to the plurality of electrode pads;
• a plurality of external terminals arranged on the other surface of said wiring board;
• conducting means for electrically connecting said connections with said external terminals corresponding to said connections, respectively;
• connection members for electrically connecting said electrode pads with said connections corresponding to said electrode pads, respectively;
• and
• a fixing member for fixing said semiconductor chip on the one surface of said wiring board such that a hollow is formed to continue to the other surface of said wiring board through said throughhole between the other surface of said semiconductor chip and the one surface of said wiring board,
• wherein at least a portion of the other surface of said semiconductor chip is disposed adjacent to said hollow, and configured to prevent stress distortion that acts on said semiconductor chip or said wiring board from being transmitted through the other surface of said semiconductor chip.

A method of manufacturing a semiconductor device including a wiring board having a semiconductor chip mounting area defined on one surface, a throughhole pierced within said semiconductor chip mounting area, a land arranged on the other surface, and a wiring pattern electrically connected to said land, and a semiconductor chip having an electrode pad disposed on one surface, said method comprising the steps of:

• securely adhering the other surface of said semiconductor chip to said semiconductor chip mounting area with an adhesive member such that said throughhole is not covered with said adhesive member;
• electrically connecting said electrode pad of said semiconductor chip with said wiring pattern through a connection member;
• forming a fixing member such that said semiconductor chip is fixed on the one surface of said wiring board;
• contracting or phase changing said adhesive member which securely adheres said semiconductor chip on said wiring board, after the formation of said fixing member, to form a hollow between the other surface of said semiconductor chip and the one surface of said wiring board;
• and
• forming an external terminal on said land of said wiring board.