Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsReza Argenty Pagaila, Byung Tai Do, Linda Pei Ee Chua
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a carrier; mounting an integrated circuit on the carrier; mounting a z-interconnect on the carrier, the z-interconnect for supporting a trace cantilevered over the integrated circuit; encapsulating the integrated circuit with an encapsulation; removing the carrier; and depositing a substrate below the integrated circuit.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a carrier;
- mounting an integrated circuit on the carrier;
- mounting a z-interconnect on the carrier, the z-interconnect for supporting a trace cantilevered over the integrated circuit;
- encapsulating the integrated circuit with an encapsulation;
- removing the carrier;
- and
- depositing a substrate below the integrated circuit.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a carrier;
- mounting integrated circuits on the carrier;
- mounting a leadframe on the carrier, the leadframe having a z-interconnect for supporting traces cantilevered over the integrated circuits;
- encapsulating the integrated circuits and at least a portion of the leadframe with an encapsulation;
- removing the carrier;
- depositing a substrate below the integrated circuit;
- and
- singulating the encapsulation to remove the leadframe.
An integrated circuit packaging system comprising:
- a substrate;
- an integrated circuit mounted on the substrate;
- a z-interconnect mounted on the substrate, the z-interconnect for supporting a trace cantilevered over the integrated circuit;
- and
- an encapsulation encapsulating the integrated circuit.
Dependencies are inferred from the claim text.