Semiconductor device and method of manufacturing the same

A semiconductor device comprising:

• a wiring substrate;
• a semiconductor chip mounted on the wiring substrate in such a manner that one surface thereof is opposed to one surface of the wiring substrate;
• a first resin which is filled in a gap between the surface of the wiring substrate and the surface of the semiconductor chip and part of which protrudes from the gap;
• and
• a second resin formed on the surface of the wiring substrate in such a manner as to cover the semiconductor chip and a portion protruding from the gap in the first resin,
• wherein the center position of the first resin and the center position of the semiconductor chip deviate from each other in a direction along the surface of the wiring substrate, and
• wherein the center position of the second resin deviates from the center position of the wiring substrate in the same direction as the deviation direction of the center position of the first resin from the center position of the semiconductor chip.

A method of manufacturing a semiconductor device, comprising:

• mounting a semiconductor chip on a wiring substrate in such a manner that one surface of the semiconductor chip is opposed to one surface of the wiring substrate;
• and
• filling a first resin in a gap between the surface of the wiring substrate and the surface of the semiconductor chip in such a manner that part of the first resin protrudes from the gap,
• wherein in the filling of the first resin, the first resin is injected into the gap by use of a first resin injection nozzle while the first resin injection nozzle is being moved along any one of sides of the semiconductor chip or along two sides of the semiconductor chip which are adjacent to each other, and
• wherein in the mounting of the semiconductor chip, the center position of the semiconductor chip is caused to deviate from the center position of the wiring substrate in the direction in which one or two sides of the semiconductor chip where, in the filling of the first resin, injection of the first resin is performed by use of the first resin injection nozzle, moves away from an end of the semiconductor device positioned nearest to the sides in question.

A method of manufacturing a semiconductor device, comprising:

• mounting a semiconductor chip on a wiring substrate in such a manner that one surface of the semiconductor chip is opposed to one surface of the wiring substrate;
• filling a first resin in a gap between the surface of the wiring substrate and the surface of the semiconductor chip in such a manner that part of the first resin protrudes from the gap;
• and
• forming a second resin on the surface of the wiring substrate in such a manner as to cover the semiconductor chip and a portion protruding from the gap in the first resin,
• wherein in the filling of the first resin, the first resin is injected into the gap by use of a first resin injection nozzle while the first resin injection nozzle is being moved along any one of sides of the semiconductor chip or along two sides of the semiconductor chip which are adjacent to each other, and
• wherein in the forming of the second resin, the center position of the second resin is caused to deviate from the center position of the wiring substrate in a direction of one side or directions of two sides of the semiconductor chip where, in the filling of the first resin, injection of the first resin is performed by use of the first resin injection nozzle.