Semiconductor packages and electronic systems including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsKyung-man Kim, In-ku Kang, Ji-hyun Lee
Life of this patent
Estimating the term…
Abstract
Provided are semiconductor packages and electronic systems including the same. A first memory chip may be stacked on a first portion of a substrate. A controller chip may be stacked on a second portion of the substrate, which is different from the first portion. At least one first bonding wire may directly connect the first memory chip with the controller chip. At least one second bonding wire may directly connect the first memory chip with the substrate, and may be electrically connected with the at least one first bonding wire.
Claims20
A semiconductor package comprising:
- a substrate;
- a first memory chip stacked on a first portion of the substrate;
- a controller chip stacked on a second portion of the substrate, the second portion being different from the first portion;
- at least one first bonding wire directly connecting the first memory chip with the controller chip;
- and
- at least one second bonding wire directly connecting the first memory chip with the substrate, the at least one second bonding wire being electrically connected with the at least one first bonding wire.
A semiconductor package comprising:
- a substrate including a plurality of bonding fingers;
- a first memory chip stacked on a first portion of the substrate, the first memory chip including a plurality of first electrode pads;
- a controller chip stacked on a second portion of the substrate, the second portion being different from the first portion and including a plurality of second electrode pads;
- a plurality of first bonding wires directly connecting the plurality of first electrode pads with the plurality of second electrode pads;
- and
- a plurality of second bonding wires directly connecting the plurality of second electrode pads with the plurality of bonding fingers,
- wherein a signal of the first memory chip is transmitted to the substrate through the plurality of first bonding wires and the plurality of second bonding wires.
Dependencies are inferred from the claim text.