Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• providing a substrate having a shielding channel through a substrate first side and a substrate second side;
• mounting a first shielding interconnect to the shielding channel;
• mounting an integrated circuit over the substrate and facing the substrate first side with the integrated circuit adjacent to the first shielding interconnect;
• mounting an internal interconnect over the substrate first side;
• attaching a silicon interposer, having an integral-conductive-shield, a contact pad, and a via, to the first shielding interconnect and the internal interconnect with the integral-conductive-shield over the integrated circuit;
• mounting a second shielding interconnect to the shielding channel along the substrate second side;
• grounding the second shielding interconnect at the substrate second side;
• and
• forming an encapsulation over the substrate covering the integrated circuit and the first shielding interconnect.

An integrated circuit packaging system comprising:

• a substrate having a shielding channel through a substrate first side and a substrate second side with the shielding channel grounded at the substrate second side;
• a first shielding interconnect mounted to the shielding channel;
• an integrated circuit mounted over the substrate and adjacent to the first shielding interconnect;
• a silicon interposer, having an integral-conductive-shield and a via, attached to the first shielding interconnect with the integral-conductive-shield over the integrated circuit;
• and
• an encapsulation over the substrate covering the integrated circuit and the first shielding interconnect.