Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsHeeJo Chi, Jae Han Chung, Junwoo Myung, YeongIm Park, HyungMin Lee
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate-interconnect; mounting an internal-interconnect to the substrate-interconnect; mounting a structure having an integral-interposer-structure over the substrate with the integral-interposer-structure connected to the internal-interconnect; mounting an integrated circuit to the substrate and under the integral-interposer-structure; and encapsulating the internal-interconnect and the integrated circuit with an encapsulation.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate having a substrate-interconnect;
- mounting an internal-interconnect to the substrate-interconnect;
- mounting a structure having an integral-interposer-structure over the substrate with the integral-interposer-structure connected to the internal-interconnect;
- mounting an integrated circuit to the substrate and under the integral-interposer-structure;
- and
- encapsulating the internal-interconnect and the integrated circuit with an encapsulation.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate having a substrate-interconnect;
- mounting an external-interconnect to the substrate-interconnect;
- mounting an internal-interconnect to the substrate-interconnect;
- mounting an interposer or an inner-stacking-module having an integral-interposer-structure over the substrate with the integral-interposer-structure connected to the internal-interconnect;
- mounting an integrated circuit to the substrate and under the integral-interposer-structure;
- and
- encapsulating the internal-interconnect and the integrated circuit with an encapsulation.
An integrated circuit packaging system comprising:
- a substrate having a substrate-interconnect;
- an internal-interconnect mounted to the substrate-interconnect;
- a structure having an integral-interposer-structure mounted over the substrate with the integral-interposer-structure connected to the internal-interconnect;
- an integrated circuit mounted to the substrate and under the integral-interposer-structure;
- and
- an encapsulation encapsulating the internal-interconnect and the integrated circuit.
Dependencies are inferred from the claim text.