Semiconductor device
AssigneeFujitsu Limited
InventorHideki Kitada
Life of this patent
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Abstract
A semiconductor device includes a first semiconductor substrate including a first integrated circuit, a second semiconductor substrate mounted over the first semiconductor substrate, the second semiconductor substrate including a second integrated circuit, a post made of an inorganic substance and formed over the first semiconductor substrate, an adhesive layer made of an organic substance arranged between the first and the second semiconductor substrates, and a substrate-through-via made of an electrical conductor extending through the second semiconductor substrate and the post, the substrate-through-via extending to the first semiconductor substrate.
Claims15
A semiconductor device comprising:
- a first semiconductor substrate including a first integrated circuit;
- a second semiconductor substrate mounted over the first semiconductor substrate, the second semiconductor substrate including a second integrated circuit;
- a post made of an inorganic substance and formed over the first semiconductor substrate;
- an adhesive layer made of an organic substance arranged between the first and the second semiconductor substrates;
- and
- a substrate-through-via made of an electrical conductor extending through the second semiconductor substrate and the post, the substrate-through-via extending to the first semiconductor substrate.
A method of manufacturing a semiconductor device comprising:
- forming a post of an inorganic substance over a first semiconductor substrate including a first integrated circuit, the post having a predetermined height;
- forming an adhesive layer over the first semiconductor substrate having the post formed thereon;
- bonding a second semiconductor substrate including a second integrated circuit and the first semiconductor substrate by the adhesive layer to each other;
- selectively removing the second semiconductor substrate and the post so as to form a via hole thorough the second semiconductor substrate and the post;
- and
- filling the via hole with an electrical conductor so as to form a substrate-through-via made of the electrical conductor extending through the second semiconductor substrate and the post.
Dependencies are inferred from the claim text.