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US 2010/0244188 A1Published application
Semiconductor device and manufacturing method thereof
AssigneeCasio Computer Co., Ltd.
InventorIchiro MIHARA
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Abstract
Disclosed is a semiconductor device comprising: a semiconductor substrate in which an integrated circuit is formed; a first resin film provided over the semiconductor substrate; a second resin film provided over an upper surface of the first resin film except at least a peripheral portion of the first resin film; and a thin film inductor provided over the second resin film.
Claims20
A semiconductor device comprising:
- a semiconductor substrate in which an integrated circuit is formed;
- a first resin film (5) provided over the semiconductor substrate;
- a second resin film (7) provided over an upper surface of the first resin film except at least a peripheral portion of the first resin film;
- and
- a thin film inductor (11) provided over the second resin film.
2 more elements
A manufacturing method of a semiconductor device, comprising:
- forming a first resin film over an entire upper surface of a semiconductor substrate in which an integrated circuit is formed, the semiconductor substrate comprising a plurality of connection pads in a peripheral portion to be connected to the integrated circuit;
- forming a second resin film in an inward region with respect to the connection pads, over the first resin film;
- and
- forming a thin film inductor over the second resin film.
1 more element
Dependencies are inferred from the claim text.