Image sensor and method of fabricating same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin
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Abstract
Provided is a method of fabricating an image sensor device. The method includes providing a device substrate having a front side and a back side. The method includes forming first and second radiation-sensing regions in the device substrate, the first and second radiation-sensing regions being separated by an isolation structure. The method also includes forming a transparent layer over the back side of the device substrate. The method further includes forming an opening in the transparent layer, the opening being aligned with the isolation structure. The method also includes filling the opening with an opaque material.
Claims20
A method of fabricating an image sensor device, comprising:
- providing a device substrate having a front side and a back side;
- forming first and second radiation-sensing regions in the device substrate, the first and second radiation-sensing regions being separated by an isolation structure;
- forming a transparent layer over the back side of the device substrate;
- forming an opening in the transparent layer, the opening being aligned with the isolation structure;
- and
- filling the opening with an opaque material.
A method of fabricating an image sensor device, comprising:
- providing a device substrate having a front side and a back side;
- forming a radiation-sensing region in the device substrate;
- forming a transparent layer over the back side of the device substrate;
- patterning the transparent layer to form a transparent feature that is substantially aligned with the radiation-sensing region and an opening that is adjacent to the transparent feature;
- and
- filling the opening with an opaque material.
An image sensor device, comprising:
- a device substrate having a front side and a back side;
- a radiation-sensing region formed in the device substrate;
- a transparent feature formed over the back side of the device substrate, the transparent feature being aligned with the radiation-sensing region;
- and
- an opaque feature formed over the back side of the device substrate and adjacent to the transparent feature;
- wherein a surface of the transparent feature and a surface of the opaque feature are substantially co-planar, and wherein the radiation-sensing region, the transparent feature, and the opaque feature are formed in a pixel region of the image sensor device, the image sensor device further including a periphery region and a bonding pad region.
Dependencies are inferred from the claim text.