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US 2010/0244171 A1Published application
Semiconductor module and camera module mounting said semiconductor module
AssigneeSanyo Electric Co., Ltd.
InventorsMasayuki Nagamatsu, Ryosuke Usui, Yasunori Inoue
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Abstract
A semiconductor module includes a lower wiring substrate having a semiconductor device mounted and an upper wiring substrate having an opening in a position corresponding to the semiconductor device and having a packaging-component mountable region around the opening. The lower wiring substrate and the upper wiring substrate are electrically connected to each other via a plurality of solder balls provided around the semiconductor device. The solder balls are covered with light blocking under-fills.
Claims13
A semiconductor module, comprising:
- a first wiring substrate having a semiconductor device mounted thereon;
- and
- a second wiring substrate having an opening in a position corresponding to said semiconductor device and having a region, where packaging components are mountable, around the opening,
- wherein said first wiring substrate and said second wiring substrate are electrically connected to each other via a plurality of conductive members being present around said semiconductor device, and
- wherein the plurality of conductive members are covered with a light blocking material.
2 more elements
Dependencies are inferred from the claim text.