Multilayer wiring substrate, stack structure sensor package, and method of manufacturing stack structure sensor package

A stack structure sensor package comprising:

• a multilayer wiring substrate, having a through hole, that includes a wire bonding pad on a first surface and an electrical connection terminal on a second surface, the electrical connection terminal being formed in at least one of an inner edge portion which is a periphery of the through hole, an outer edge portion which is an outer periphery of the substrate, and a non-edge portion;
• an image sensor that is fixed to the periphery of the through hole on the first surface of the multilayer wiring substrate so as to lay across the through hole of the multilayer wiring substrate, and is electrically connected to the pad by a wire;
• a frame that is fixed to the outer edge portion on the first surface of the multilayer wiring substrate so as to surround the image sensor;
• and
• an optical filter that is fixed to a surface of the frame so as to face the image sensor.

A method of manufacturing a stack structure sensor package, comprising the steps of:

• fixing an image sensor to a periphery of a through hole on a first surface of a multilayer wiring substrate so as to lay across the through hole of the multilayer wiring substrate, the multilayer wiring substrate having the through hole and including a wire bonding pad on the first surface and an electrical connection terminal on a second surface, the electrical connection terminal being formed in at least one of an inner edge portion which is the periphery of the through hole, an outer edge portion which is an outer periphery of the substrate, and a non-edge portion;
• electrically connecting the pad of the multilayer wiring substrate and the image sensor by a wire;
• fixing a frame to the outer edge portion on the first surface of the multilayer wiring substrate so as to surround the image sensor;
• and
• fixing an optical filter to a surface of the frame so as to face the image sensor.