Wafer level packaging using flip chip mounting
AssigneeSkyworks Solutions, Inc.
InventorBehnam Tabrizi
Life of this patent
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Abstract
A semiconductor packaged device, and method of packaging that incorporates the formation of cavities about electronic devices during the packaging process. In one example, the device package includes a first substrate having a first recess formed therein, a second substrate having a second recess formed therein, and an electronic device mounted in the first recess. The first and second substrates are joined together with the first and second recesses substantially overlying one another so as to form a cavity around the electronic device.
Claims22
A package for electronic devices comprising:
- a first substrate comprising a first recess defined in a first surface of the first substrate;
- and
- a second substrate comprising a second recess defined in a second surface of the second substrate;
- wherein the first surface of the first substrate is joined to the second surface of the second substrate;
- and
- wherein the first recess substantially overlies the second recess to define a cavity formed by the first recess and the second recess.
A method of manufacturing a packaged electronic device, the method comprising:
- forming a first recess in a first substrate;
- forming a second recess in a second substrate;
- and
- attaching the first substrate to the second substrate such that first recess and the second recess substantially overly one another so as to define a cavity.
Dependencies are inferred from the claim text.