Mems sensor, mems sensor manufacturing method, and electronic device
AssigneeSeiko Epson Corporation
InventorKei KANEMOTO
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AssigneeSeiko Epson Corporation
InventorKei KANEMOTO
Estimating the term…
A MEMS sensor formed by processing a multi-layer wiring structure, includes: a movable weight portion coupled to a fixed frame portion with an elastic deformable portion and having a hollow portion formed at the periphery; a capacitance electrode portion including a fixed electrode portion fixed to the fixed frame portion and a movable electrode portion connected to the movable weight portion and arranged to face the fixed electrode portion; and an adjusting layer for adjusting at least one of amass of the movable weight portion, a damping coefficient of the movable electrode portion, and spring characteristics in the elastic deformable portion, wherein the adjusting layer includes at least one insulating layer that is a constituent element of the multi-layer wiring structure.
A MEMS sensor comprising:
A MEMS sensor manufacturing method for a MEMS sensor including a support portion;
Dependencies are inferred from the claim text.