A method of manufacturing a group-III nitride compound semiconductor light-emitting device, comprising the steps of:
- forming an intermediate layer made of a group-III nitride compound on a substrate by activating and reacting gas including a group-V element with a metal material in plasma;
- and
- sequentially forming an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer each made of a group-III nitride compound semiconductor on the intermediate layer,
- wherein nitrogen is used as the group-V element, and
- the thickness of the intermediate layer is in the range of 20 to 80 nm.