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AssigneeKoninklijke Philips Electronics N.V.
InventorsRabin Bhattacharya, Pieter J. Snijder, Liesbeth Van Pieterson, Erich Zainzinger
Estimating the term…
A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.
A submount (100) for arranging electronic components (150) on a substrate, comprising a head member (101) having an upper side and a substrate side and at least one substrate-engaging member (132, 133) protruding from the substrate side of said head member (101), wherein said head member (101) comprises at least two, from each other isolated, electrically conductive portions (102, 103), each electrically conductive portion (102, 103) comprising a component contact (112, 113) for connection of electronic components thereto, and a substrate contact (122, 123) arranged on said substrate side for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate.
Dependencies are inferred from the claim text.