Reduced-crosstalk wirebonding in an optical communication system
AssigneeAvago Technologies Fiber IP (Singapore) Pte. Ltd.
InventorsPeter Ho, Michael A. Robinson, Zuowei Shen
Life of this patent
Estimating the term…
Abstract
Wirebonds are formed to couple an opto-electronic device chip having two or more opto-electronic devices to a signal processing chip. Two or more mutually adjacent wirebond groups, each corresponding to one of the opto-electronic devices, are formed. For example, each wirebond group can include a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip, a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip, and a third wirebond coupling the opto-electronic device chip to the signal processing chip.
Claims21
A system for coupling an opto-electronic device chip having a plurality of opto-electronic devices to a signal processing chip, comprising:
- a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic devices, each wirebond group comprising three wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
- wherein each wirebond group comprises:
- a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
- a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip;
- and
- a third wirebond coupling the opto-electronic device chip to the signal processing chip.
A system for coupling an opto-electronic device chip having a plurality of opto-electronic devices to a signal processing chip, comprising:
- a plurality of wirebond groups, each wirebond group corresponding to one of the opto-electronic devices, each wirebond group comprising exactly two wirebonds, each wirebond group being adjacent to another wirebond group of the plurality of wirebond groups;
- wherein each wirebond group comprises:
- a first wirebond coupling a terminal of the opto-electronic device of the wirebond group to the signal processing chip;
- a second wirebond coupling a terminal of the opto-electronic device of the wirebond group to the signal processing chip;
- and
- wherein the first and second wirebonds cross each other exactly once.
Dependencies are inferred from the claim text.