Back to results
US 2010/0170701 A1Published application
Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board
AssigneeHitachi Chemical Company, Ltd.
InventorsMasaki Takeuchi, Katsuyuki Masuda, Kenichi Tomioka, Takako Ejiri
Life of this patent
Estimating the term…
Abstract
A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).
Claims10
A polyamide-imide resin obtained by a process comprising the step of reacting a diimide dicarboxylic acid with an aromatic diisocyanate,
- wherein said diimide dicarboxylic acid contains 40 mol % or more of a compound represented by the following general formula (1), and
- 20 mol % or more of a compound represented by the following general formula (2).
- wherein n1 is an integer of 1 to 100 in the formula (1), and R1 and R2 each independently represent a divalent organic group, R3 and R4 each independently represent a C1-20 alkyl group or a C6-18 aryl group, a plurality of R3 and R4 in the same molecule may be the same or different, and n2 is an integer of 1 to 50 in the formula (2).
Dependencies are inferred from the claim text.