# US 2010/0167462 A1 · Method for manufacturing resistance ram device

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- Number: US 2010/0167462 A1
- Document ID: US20100167462A1
- Status: Published application
- Kind: A1
- Application number: 12/427,819
- Filed: 2009-04-22
- Published: 2010-07-01
- Earliest claimed: 2008-12-30
- Assignees: Hynix Semiconductor Inc.
- Inventors: Yu Jin LEE
- Web page: https://patentgrep.com/patent/US20100167462A1

## CPC

- H10N 70/20: Multistable switching devices, e.g. memristors
- H10N 70/026: {by physical vapor deposition, e.g. sputtering}
- H10N 70/061: {Shaping switching materials}
- H10N 70/826: {adapted for essentially vertical current flow, e.g. sandwich or pillar type devices}
- H10N 70/8833: {Binary metal oxides, e.g. TaOx}
- H10N 70/8836: {Complex metal oxides, e.g. perovskites, spinels}
- H10B 63/30: {comprising selection components having three or more electrodes, e.g. transistors}
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B: ELECTRONIC MEMORY DEVICES

## Abstract

Manufacturing a resistance RAM device includes the steps of forming an insulation layer on a semiconductor substrate having a bottom electrode contact; etching the insulation layer to define a hole exposing the bottom electrode contact; depositing sequentially a bottom electrode material layer and a TMO material layer selectively within the hole; depositing a top electrode material layer within the hole and on the insulation layer in such a way as to completely fill the hole in which the bottom electrode material layer and the TMO material layer are formed; removing partial thicknesses of the top electrode material layer and the insulation layer to form a stack pattern comprising a bottom electrode, a TMO, and a top electrode.

## Claims

### Claim 1

A method for manufacturing a resistance RAM device, comprising:
forming an insulation layer on a semiconductor substrate having a bottom electrode contact;
etching the insulation layer to define a hole exposing the bottom electrode contact;
depositing sequentially a bottom electrode material layer and a TMO material layer selectively within the hole;
depositing a top electrode material layer within the hole and on the insulation layer in such a way as to completely fill the hole in which the bottom electrode material layer and the TMO material layer are formed; and
removing partial thicknesses of the top electrode material layer and the insulation layer to form a stack pattern comprising a bottom electrode, a TMO, and a top electrode.

### Claim 2 (depends on 1)

The method according to claim 1, further comprising:
before forming the insulation layer:
forming a switching element on the semiconductor substrate;
forming a plug on the switching element such that the plug is electrically connected to the switching element;
forming a metal pad on the plug; and
forming the bottom electrode contact on the metal pad such that the bottom electrode contact is electrically connected to the metal pad.

### Claim 3 (depends on 2)

The method according to claim 2, wherein the bottom electrode contact is formed to a height in the range of 80˜4,000 Å.

### Claim 4 (depends on 1)

The method according to claim 1, wherein the hole is defined to have an aspect ratio in the range of 5:1˜20:1.

### Claim 5 (depends on 1)

The method according to claim 1, wherein the bottom electrode material layer and the top electrode material layer comprise at least one of Ti, Ni, Al, Au, Ag, Pt, Cu and Cr.

### Claim 6 (depends on 1)

The method according to claim 1, wherein the TMO material layer comprises at least one binary transition metal oxide selected from MgO, ZnO, TiO2, NiO, SiO2, Nb2O5 and HfO2.

### Claim 7 (depends on 1)

The method according to claim 1, wherein the TMO material layer is formed of at least one perovskite-based material selected from PCMO and LCMO.

### Claim 8 (depends on 1)

The method according to claim 1, wherein deposition of the bottom electrode material layer, the TMO material layer and the top electrode material layer is implemented through an IMP-PVD process.

### Claim 9 (depends on 1)

The method according to claim 1, further comprising:
after forming the stack pattern comprising the bottom electrode, the TMO, and the top electrode:
forming a top electrode contact on the stack pattern such that the top electrode contact is electrically connected to the top electrode; and
forming a metal line on the top electrode contact.