# US 2010/0167210 A1 · Multi-layer embedded capacitance and resistance substrate core

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- Number: US 2010/0167210 A1
- Document ID: US20100167210A1
- Status: Published application
- Kind: A1
- Application number: 12/720,849
- Filed: 2010-03-10
- Published: 2010-07-01
- Earliest claimed: 2008-09-09
- Assignees: Endicott Interconnect Technologies, Inc.
- Inventors: Rabindra N. Das; John M. Lauffer; Irving Memis; Steven G. Rosser
- Web page: https://patentgrep.com/patent/US20100167210A1

## CPC

- H05K 1/162: {incorporating printed capacitors}
- H05K 1/0234: {Resistors or by disposing resistive or lossy substances in or near power planes (H05K1/0246 takes precedence)}
- H05K 1/167: {incorporating printed resistors}
- H05K 1/023: {using auxiliary mounted passive components or auxiliary substances (printed passive components H05K1/16)}
- H05K 3/0032: {of organic insulating material}
- H05K 3/0038: {combined with laser drilling through a metal layer}
- H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers}
- H05K 3/4652: {Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence)}
- H05K 2201/0209: Inorganic, non-metallic particles
- H05K 2201/0355: Metal foils
- H05K 2203/0361: Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
- Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T 428/12493: Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T 428/24917: including metal layer
- Y10T 428/31511: Of epoxy ether
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.

## Claims

### Claim at position 1

1-5. (canceled)

### Claim 6

A method of making a multi-layer embedded capacitance and resistance substrate core, the steps comprising:
a) providing a Laser drillable dielectric having an upper surface and a lower surface;
b) disposing a first resistance layer on the upper surface of said Laser drillable dielectric;
c) disposing a first electrically conductive layer on said first resistance layer;
d) laminating said laser drillable dielectric, said first resistance layer and said first electrically conductive layer to form a first resistance structure;
e) applying and developing a first resist to said first electrically conductive layer;
f) selectively etching said first electrically conductive layer;
g) stripping said first resist from said first electrically conductive layer;
h) disposing a first copper-coated capacitance layer on said first electrically conductive layer;
i) laminating said first copper-coated capacitance layer and said first resistance structure;
j) applying and developing a second resist on said first resistance structure;
k) stripping said second resist; and
l) selectively etching said first copper-coated capacitance layer.

### Claim 7 (depends on 6)

The method of making a multi-layer embedded capacitance and resistance substrate core in accordance with claim 6, wherein said electrically conductive layer comprises copper foil.

### Claim 8 (depends on 6)

The method of making a multi-layer embedded capacitance and resistance substrate core in accordance with claim 6, the steps further comprising laser-forming thru-holes in said substrate.

### Claim 9 (depends on 6)

The method of making a multi-layer embedded capacitance and resistance substrate core in accordance with claim 6, the steps further comprising:
m) disposing a second resistance layer on the lower surface of said laser drillable dielectric;
n) disposing a second electrically conductive layer on said second resistance layer;
o) laminating said laser drillable dielectric, said second resistance layer and said second electrically conductive layer to form a second resistance structure;
p) applying and developing a third resist to said second electrically conductive layer;
q) selectively etching said second electrically conductive layer;
r) stripping said third resist from said second electrically conductive layer;
s) disposing a second copper-coated capacitance layer on said second electrically conductive layer;
t) laminating said second copper-coated capacitance layer and said second resistance structure;
u) applying and developing a fourth resist on said second resistance structure;
v) stripping said fourth resist; and
w) selectively etching said second copper-coated capacitance layer.

### Claim 10 (depends on 9)

The method of making a multi-layer embedded capacitance and resistance substrate core in accordance with claim 9, wherein said second electrically conductive layer comprises copper foil.

### Claim 11 (depends on 9)

The method of making a multi-layer embedded capacitance and resistance substrate core in accordance with claim 9, the steps further comprising laser-forming thru-holes in said substrate.

### Claim at position 8

12-16. (canceled)