# US 2010/0167205 A1 · Thermally curable solder resist composition

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- Number: US 2010/0167205 A1
- Document ID: US20100167205A1
- Status: Published application
- Kind: A1
- Application number: 12/437,217
- Filed: 2009-05-07
- Published: 2010-07-01
- Earliest claimed: 2008-12-30
- Assignees: Industrial Technology Research Institute
- Inventors: Jhy-Long JENG; Jeng-Yu TSAI; Shur-Fen LIU; Jinn-Shing KING
- Web page: https://patentgrep.com/patent/US20100167205A1

## CPC

- H05K 3/285: {Permanent coating compositions}
- C08G 59/066: {with chain extension or advancing agents}
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- H05K 2201/0145: Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.

## Claims

### Claim 1

A thermally curable solder resist composition for a flexible printed circuit board, comprising:
(a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin comprises at least an aliphatic polyester modified epoxy resin represented by Formula (I) or (II):
and wherein each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000;
(b) 1-10 parts by weight of a curing agent; and
(c) 1-10 parts by weight of a catalyst.

### Claim 2 (depends on 1)

The thermally curable solder resist composition as claimed in claim 1, wherein the aliphatic polyester modified epoxy resin are 30-100 weight % based on the total epoxy resin.

### Claim 3 (depends on 1)

The thermally curable solder resist composition as claimed in claim 1, wherein the epoxy resin comprises bisphenol-A epoxy resin, cycloaliphatic epoxy resin, phenyl containing epoxy resin, bisphenyl containing epoxy resin, phenolic epoxy resin, carboxyl-terminated acrylonitrile-butadiene (CTBN) modified epoxy resin or combinations thereof.

### Claim 4 (depends on 1)

The thermally curable solder resist composition as claimed in claim 1, wherein the curing agent comprises an anhydride derivative, a diamine derivative, or polyamine.

### Claim 5 (depends on 4)

The thermally curable solder resist composition as claimed in claim 4, wherein the anhydride derivative comprises methyl hexahydrophthalic anhydride (MHHPA) or methyltetrahydrophthalic anhydride.

### Claim 6 (depends on 4)

The thermally curable solder resist composition as claimed in claim 4, wherein the diamine derivative comprises 4,4-diaminodiphenyl sulfone.

### Claim 7 (depends on 4)

The thermally curable solder resist composition as claimed in claim 4, wherein the polyamine comprises polyether diamine.

### Claim 8 (depends on 1)

The thermally curable solder resist composition as claimed in claim 1, wherein the catalyst comprises an imidazole derivative.

### Claim 9 (depends on 8)

The thermally curable solder resist composition as claimed in claim 8, wherein the imidazole derivative comprises 2-ethyl-4-methyl-imidazole, 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]1,3,5-triazine, or 2-methylimidazole.

### Claim 10 (depends on 1)

The thermally curable solder resist composition as claimed in claim 1, further comprising an additive.

### Claim 11 (depends on 10)

The thermally curable solder resist composition as claimed in claim 10, wherein the additive comprises a leveling agent, an inorganic filler, a pigment, a deformer, a flame retardant or combinations thereof.