# US 2010/0167073 A1 · Adhesive film and semiconductor device using same

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- Number: US 2010/0167073 A1
- Document ID: US20100167073A1
- Status: Published application
- Kind: A1
- Application number: 11/997,928
- Filed: 2006-08-03
- Published: 2010-07-01
- Earliest claimed: 2005-08-05
- Inventors: Tsutomu Kitakatsu
- Web page: https://patentgrep.com/patent/US20100167073A1

## CPC

- C09J 179/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G 59/08: from phenol-aldehyde condensates
- C08G 59/4042: {Imines; Imides}
- C09J 7/10: without carriers
- C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L 79/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L 2666/02: Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L 2666/22: Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
- C09J 2463/00: Presence of epoxy resin
- C09J 2479/08: polyimide
- H10W 72/30: Die-attach connectors
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 428/31721: Of polyimide
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The present invention relates to an adhesive film comprising a polyimide resin (A) and a thermosetting resin (B), wherein the polyimide resin (A) comprises a polyimide resin having a repeating unit represented by a formula (I) shown below, and the storage elastic modulus of the adhesive film at 250° C., following heat treatment at a temperature of 150 to 230° C. for a period of 0.3 to 5 hours, is not less than 0.2 MPa: (wherein, the m R1 groups each represent, independently, a bivalent organic group, the m R1 groups include a total of k organic groups selected from the group consisting of —CH2—, —CHR— and —CR2— (wherein, R represents a non-cyclic alkyl group of 1 to 5 carbon atoms), m represents an integer of not less than 8, m and k satisfy a relationship: k/m≧0.85, and R2 represents a tetracarboxylic acid residue).

## Claims

### Claim 1

An adhesive film comprising a polyimide resin (A) and a thermosetting resin (B), wherein
the polyimide resin (A) comprises a polyimide resin having a repeating unit represented by a formula (I) shown below, and
a storage elastic modulus of the adhesive film at 250° C., following heat treatment at a temperature of 150 to 230° C. for a period of 0.3 to 5 hours, is not less than 0.2 MPa:
(wherein, m R1 groups each represent, independently, a bivalent organic group, the m R1 groups include a total of k organic groups selected from the group consisting of —CH2—, —CHR— and —CR2— (wherein, R represents a non-cyclic alkyl group of 1 to 5 carbon atoms), m represents an integer of not less than 8, m and k satisfy a relationship: k/m≧0.85, and R2 represents a tetracarboxylic acid residue).

### Claim 2 (depends on 1)

The adhesive film according to claim 1, having a storage elastic modulus at 125° C. prior to heat treatment of not less than 0.1 MPa.

### Claim 3 (depends on 1)

The adhesive film according to claim 1, wherein the polyimide resin (A) comprises a polyimide resin obtained by reacting a diamine and a tetracarboxylic dianhydride, and the diamine comprises not less than 50 mol % of a diamine represented by a formula (II) shown below:
(wherein, m R1 groups each represent, independently, a bivalent organic group, the m R1 groups include a total of k organic groups selected from the group consisting of —CH2—, —CHR— and —CR2— (wherein, R represents a non-cyclic alkyl group of 1 to 5 carbon atoms), m represents an integer of not less than 8, and m and k satisfy a relationship: k/m≧0.85).

### Claim 4 (depends on 3)

The adhesive film according to claim 3, wherein the tetracarboxylic dianhydride comprises not less than 60 mol % of a tetracarboxylic dianhydride represented by a formula (III) shown below.

### Claim 5 (depends on 1)

The adhesive film according to claim 1, wherein the thermosetting resin (B) comprises an epoxy resin (B1) and an epoxy resin curing agent (B2).

### Claim 6 (depends on 5)

The adhesive film according to claim 5, wherein the epoxy resin (B1) comprises a novolak epoxy resin represented by a formula (IV) shown below:
(wherein, each of a plurality of R3 groups represents, independently, a hydrogen atom, an alkyl group of 1 to 5 carbon atoms that may contain a substituent group, or a phenyl group that may contain a substituent group, and p represents an integer from 1 to 20).

### Claim 7 (depends on 5)

The adhesive film according to claim 5, wherein the epoxy resin curing agent (B2) comprises a phenol-based compound with a number average molecular weight within a range from 400 to 1,500 that contains two or more hydroxyl groups within each molecule.

### Claim 8 (depends on 5)

The adhesive film according to claim 5, wherein the epoxy resin curing agent (B2) comprises a naphthol-based compound that contains three or more aromatic rings within each molecule, or a trisphenol-based compound.

### Claim 9 (depends on 1)

The adhesive film according to claim 1, further comprising a filler (C).

### Claim 10 (depends on 9)

The adhesive film according to claim 9, wherein the filler (C) has an average particle size of not more than 10 μm and a maximum particle size of not more than 25 μm.

### Claim 11 (depends on 1)

The adhesive film according to claim 1, comprising from 1 to 200 parts by weight of the thermosetting resin (B) per 100 parts by weight of the polyimide resin (A).

### Claim 12 (depends on 9)

The adhesive film according to claim 9, comprising from 1 to 8,000 parts by weight of the filler (C) per 100 parts by weight of the polyimide resin (A).

### Claim 13 (depends on 1)

A semiconductor device having a structure in which the adhesive film according to claim 1 is used to bond together a semiconductor element and a semiconductor element, or a semiconductor element and a support member.