# US 2010/0167022 A1 · Composition, coated film formed of the composition, layered product containing the coated film, and electronic device incorporating the layered product > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2010/0167022 A1 - Document ID: US20100167022A1 - Status: Published application - Kind: A1 - Application number: 12/398,954 - Filed: 2009-03-05 - Published: 2010-07-01 - Earliest claimed: 2008-12-26 - Assignees: Asahi Kasei Kabushiki Kaisha; Pi R&D Co., Ltd. - Inventors: Hiroaki ADACHI; Enhai Sun; Eiji Honda; Yoro Sasaki; Syuzou Waki; Toshiyuki Goshima; Yoshikazu Nishikawa - Web page: https://patentgrep.com/patent/US20100167022A1 ## CPC - C08L 79/08: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors - C08G 73/1032: {characterised by the solvent(s) used} - C08G 73/106: {containing silicon} - C08K 3/22: of metals - H05K 1/0346: {containing N} - C08G 77/455: containing polyamide, polyesteramide or polyimide sequences - C08K 5/57: Organo-tin compounds - H05K 3/285: {Permanent coating compositions} - H05K 3/4673: {Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K3/28)} - H05K 2201/0154: Polyimide - H05K 2203/0759: Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer - H05K 2203/0783: Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity - Y10T 428/24802: Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract [Object] To provide a composition that has good viscosity stability and flowability at the time of processing, good shape retention after the processing, and good drying property in a temperature range of not degrading the conductor layer at the time of drying and that enables a coated film excellent in strength of adhesion with metal·polyimide, flame resistance, heat resistance, flexibility, mechanical properties, and chemical resistance to obtained after being dried. [Overcoming Means] The composition of the invention contains (A) polyimide and (B) mixed solvent of two kinds or more, and the solubility parameter of the mixed solvent of two kinds or more ranges from 9 to 14. ## Claims ### Claim 1 A composition containing: polyimide; and a mixed solvent of two kinds or more, wherein a solubility parameter of the mixed solvent of two kinds or more ranges from 9 to 14. ### Claim 2 (depends on 1) The composition according to claim 1, wherein the solubility parameter of the polyimide ranges from 9 to 14. ### Claim 3 (depends on 1) The composition according to claim 1, wherein an absolute value of a difference between the solubility parameter of the polyimide and the solubility parameter of the mixed solvent of two kinds or more is 2 or less. ### Claim 4 (depends on 1) The composition according to claim 1, wherein when solubility parameters of respective solvents contained in the mixed solvent of two kinds or more are compared with one another, an absolute value of a difference between the solubility parameter of a solvent with the highest solubility parameter and the solubility parameter of another solvent with the lowest solubility parameter is 1.2 or more. ### Claim 5 (depends on 1) The composition according to claim 1, wherein the composition contains an aromatic type solvent with the solubility parameter ranging from 9 to 10, and a polar solvent with the solubility parameter ranging from 8.5 to 15. ### Claim 6 (depends on 5) The composition according to claim 5, wherein an absolute value of a difference between the solubility parameter of the aromatic type solvent and the solubility parameter of the polar solvent ranges from 1 to 5. ### Claim 7 (depends on 1) The composition according to claim 1, wherein the rate of volatilization of the composition is 2.0 percent by mass/hour or less. ### Claim 8 (depends on 1) The composition according to claim 1, wherein the polyimide contains a chemical structure with the solubility parameter ranging from 6 to 8, and another chemical structure with the solubility parameter ranging from 10 to 14. ### Claim 9 (depends on 1) The composition according to claim 1, wherein the polyimide is organosilicon-group-containing polyimide. ### Claim 10 (depends on 5) The composition according to claim 5, wherein the aromatic type solvent is a benzoate type solvent. ### Claim 11 (depends on 10) The composition according to claim 10, wherein the aromatic type solvent is a benzoate type solvent having a hydrocarbon group with the carbon number between 3 and 5. ### Claim 12 (depends on 11) The composition according to claim 11, wherein the aromatic type solvent is butyl benzoate. ### Claim 13 (depends on 5) The composition according to claim 5, wherein the polar solvent is a solvent containing one or more of acetamide type solvent, pyrrolidone type solvent and lactone type solvent. ### Claim 14 (depends on 13) The composition according to claim 13, wherein the polar solvent is the lactone type solvent. ### Claim 15 (depends on 14) The composition according to claim 14, wherein the polar solvent is γ-butyrolactone. ### Claim 16 (depends on 5) The composition according to claim 5, wherein the content of the aromatic type solvent ranges from 60 percent by mass to 95 percent by mass. ### Claim 17 (depends on 9) The composition according to claim 9, wherein the polyimide is polyimide synthesized using 15 to 80 percent by mass of diamine having an organosilicon group. ### Claim 18 (depends on 9) The composition according to claim 9, wherein the diamine containing an organosilicon group has a structure shown by following formula (1). (where each of R1, R2, R3 and R4 in formula (1) independently represents an aliphatic group, alicyclic group, aromatic group, or aromatic group replaced with one to three aliphatic groups or oxygen-containing aliphatic group, each of 1 and m represents an integer ranging from 1 to 3, and n represents an integer ranging from 3 to 30.) ### Claim 19 (depends on 9) The composition according to claim 9, wherein the polyimide is obtained by reacting organosilicon-group-containing polyimide oligomer obtained by reacting acid dianhydride and the diamine containing an organosilicon group, acid dianhydride and diamine without containing an organosilicon group. ### Claim 20 (depends on 1) The composition according to claim 1, wherein the weight average molecular weight of the polyimide ranges from 30,000 to 200,000. ### Claim 21 (depends on 1) The composition according to claim 1, wherein the content of the polyimide ranges from 10 percent by mass to 50 percent by mass. ### Claim 22 (depends on 1) The composition according to claim 1, further containing: (C) particles of metal hydroxide. ### Claim 23 (depends on 22) The composition according to claim 22, wherein the composition contains 100 parts by mass of the polyimide, 1 to 1000 parts by mass of the mixed solvent of two kinds or more, and 5 to 50 parts by mass of particles of metal hydroxide. ### Claim 24 (depends on 23) The composition according to claim 23, wherein the particles of metal hydroxide are subjected to surface treatment with silicon dioxide, and has an average particle size ranging from 0.1 μm to 5 μm, and the specific surface area ranging from 5 m2/g to 50 m2/g. ### Claim 25 (depends on 22) The composition according to claim 22, wherein the content of heavy metal is 1 percent by mass or less among the particles of metal hydroxide. ### Claim 26 (depends on 24) The composition according to claim 24, wherein the content of silicon derived from silicon dioxide of the particles of metal hydroxide ranges from 1 percent by mass to 30 percent by mass. ### Claim 27 (depends on 1) The composition according to claim 1, wherein the composition contains 100 parts by mass of the polyimide, and (D) 0.1 to 10 parts by mass of acetylacetone metal complex. ### Claim 28 (depends on 27) The composition according to claim 27, wherein the acetylacetone metal complex is a complex of light metal. ### Claim 29 (depends on 28) The composition according to claim 28, wherein the acetylacetone metal complex is aluminium complex. ### Claim 30 (depends on 1) A composition, wherein a wet film with a film thickness of 25 μm does not change to white after being let stand for an hour under conditions at 23° C. and at the humidity of 50%, the wet film obtained by coating and leveling the composition according to claim 1. ### Claim 31 (depends on 1) A coated film obtained by coating, leveling and drying the composition according to claim 1. ### Claim 32 (depends on 1) A coated film obtained by subjecting the composition according to claim 1 to heat treatment at temperatures of 250° C. or less. ### Claim 33 (depends on 1) A coated film obtained by drying the composition according to claim 1 at temperatures between 80° C. and 150° C. for 10 minutes to 120 minutes, and then subjecting the composition to heat treatment at temperatures between 150° C. and 250° C. for 10 minutes to 40 minutes. ### Claim 34 (depends on 1) A coated film formed of the composition according to claim 1, wherein the solvent content ranges from 3 ppm to 100 ppm. ### Claim 35 (depends on 1) A coated film formed of the composition according to claim 1, wherein a film thickness after drying ranges from 1 μm to 50 μm. ### Claim 36 (depends on 1) Ink formed of the composition according to claim 1. ### Claim 37 (depends on 36) The ink according to claim 36, wherein the ink is used in screen printing. ### Claim 38 (depends on 31) A layered product containing the coated film according to claim 31. ### Claim 39 (depends on 38) The layered product according to claim 38, wherein the product includes an electric circuit pattern. ### Claim 40 (depends on 31) A layered product containing a flexible insulating material, and the coated film according to claim 31 formed on the insulating material. ### Claim 41 (depends on 40) The layered product according to claim 40, wherein the flexible insulating material is formed of polyimide. ### Claim 42 (depends on 40) The layered product according to claim 40, wherein a film thickness of the flexible insulating material ranges from 3 μm to 150 μm. ### Claim 43 (depends on 39) The layered product according to claim 39, wherein the electric circuit pattern includes a conductor layer formed of metal. ### Claim 44 (depends on 43) The layered product according to claim 43, wherein the electric circuit pattern includes a conductor layer formed of metal foil. ### Claim 45 (depends on 43) The layered product according to claim 43, wherein the electric circuit pattern includes a conductor layer formed of electrolytic metal foil or rolled metal foil. ### Claim 46 (depends on 39) The layered product according to claim 39, wherein the electric circuit pattern includes a conductor layer formed of copper. ### Claim 47 (depends on 31) A layered product, wherein the coated film according to claim 31 is formed on an electric circuit pattern. ### Claim 48 (depends on 38) The layered product according to claim 38, wherein the product includes an independent area less than 2000 μm without the coated film. ### Claim 49 (depends on 31) A layered product including an independent area of 2000 μm or more with the coated film according to claim 31 applied thereon. ### Claim 50 (depends on 38) The layered product according to claim 38, wherein the conductor layer without the coated film is provided with nickel-gold plating. ### Claim 51 (depends on 31) A layered product, wherein in an interface between a conductor layer with the coated film according to claim 31 applied thereon and the conductor layer without the coated film, crawling of nickel-gold plating is less than 100 μm on the side of the conductor layer with the coated film. ### Claim 52 (depends on 39) The layered product according to claim 39, wherein the product is mounted with an electronic component. ### Claim 53 (depends on 39) An electronic device incorporating the layered product according to claim 39 with the product bent.