# US 2010/0166535 A1 · System and method for separating defective dies from wafer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2010/0166535 A1 - Document ID: US20100166535A1 - Status: Published application - Kind: A1 - Application number: 12/648,234 - Filed: 2009-12-28 - Published: 2010-07-01 - Earliest claimed: 2008-12-31 - Assignees: Cheng Mei Instrument Technology Co., Ltd. - Inventors: TE CHUN CHEN; CHIEN CHAO HUANG; CHENG TAO TSAI - Web page: https://patentgrep.com/patent/US20100166535A1 ## CPC - H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates} - H10P 72/0611: {Sorting devices} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A system separating defective dies from a wafer comprises a film frame platform and a pick-and-place device. The film frame platform comprises a support table assembly configured for supporting a film frame assembly and a platform surface configured to receive the placement of bins thereupon. The pick-and-place device is configured for moving in a linear manner between the support table assembly and the platform surface. ## Claims ### Claim 1 A system for separating defective dies from a wafer, the system being configured for picking and placing defective dies from a film frame assembly to a bin, and comprising: a film frame platform comprising a support table assembly and a platform surface adjacent to the support table assembly, the support table assembly configured to support the film frame assembly, and the platform surface configured to place the bin; and a pick-and-place device configured to move in a linear manner between the support table assembly and the platform surface. ### Claim 2 (depends on 1) The system of claim 1, further comprising a first linear motion device disposed in a zone above the film frame platform and configured to move the pick-and-place device in a linear manner. ### Claim 3 (depends on 2) The system of claim 2, wherein the first linear motion device comprises two sliding tables and a linear motor configured to drive the two sliding tables, and the pick-and-place device is attached to one of the two sliding tables. ### Claim 4 (depends on 3) The system of claim 3, further comprising an optical sensing device configured to provide a defect map and attached to the other sliding table. ### Claim 5 (depends on 4) The system of claim 4, further comprising a computing device configured to update a wafer map of the film frame assembly with the defect map. ### Claim 6 (depends on 4) The system of claim 4, wherein the optical sensing device comprises an imaging sensor, the imaging sensor is a charge-coupled device image sensor or a complementary metal-oxide semiconductor sensor. ### Claim 7 (depends on 2) The system of claim 2, further comprising a second linear motion device configured to move the film frame platform. ### Claim 8 (depends on 7) The system of claim 7, wherein motion directions of the first linear motion device and the second linear motion device are mutually orthogonal. ### Claim 9 (depends on 1) The system of claim 1, further comprising a die ejector disposed below the support table assembly and configured to partially detach defective dies from a film on which the defective dies are attached. ### Claim 10 (depends on 1) The system of claim 1, further comprising: a loading station configured to contain film frame assemblies waiting for inspection; an unloading station configured to contain inspected film frame assemblies; and a swing arm mechanism including a swing arm, a motion device and a nozzle, wherein the nozzle is attached to the motion device so that the nozzle moves between the loading station and the unloading station, and the swing arm causes the nozzle to move between the support table assembly and the loading station or the unloading station. ### Claim 11 (depends on 10) The system of claim 10, wherein each of the loading station and the unloading station further comprises a vertical motion mechanism for handling a stack of the film frame assemblies. ### Claim 12 (depends on 1) The system of claim 1, wherein the support table assembly further comprises at least one stationary clamping member and a movable clamping member, and the stationary clamping member and the movable clamping member are configured to hold the film frame assembly. ### Claim 13 (depends on 1) The system of claim 1, further comprising a displacement range of motion, wherein the displacement range of motion covers an area of the support table assembly, an area of the platform surface, and an area between the support table assembly and the platform surface, and the periodic time interval in which the pick-and-place device moves within the displacement range of motion is less than 0.35 seconds. ### Claim 14 A method for separating defective dies from a wafer, comprising the steps of: obtaining a defect map of a wafer from a film frame assembly, wherein a film frame platform comprises a support table assembly and a platform surface adjacent to the support table assembly, and the film frame assembly is supported by the support table assembly; and removing defective dies from the film frame assembly to a bin placed on the platform surface by using a linear motion device and in accordance with the defect map. ### Claim 15 (depends on 14) The method of claim 14, further comprising a step of updating a wafer map of the film frame assembly with the defect map. ### Claim 16 (depends on 14) The method of claim 14, further comprising the steps of: measuring an angular error of the film frame assembly; and compensating the angular error. ### Claim 17 (depends on 14) The method of claim 14, wherein the removing step further comprises a step of calculating a coordinate of each defective die of the film frame assembly. ### Claim 18 (depends on 14) The method of claim 14, further comprising steps of: measuring a datum point of a group of dies on the film frame assembly; and updating a coordinate of each defective die in the group of dies using the datum point. ### Claim 19 (depends on 14) The method of claim 14, wherein the obtaining step comprises a step of scanning the film frame assembly using an optical sensing device. ### Claim 20 (depends on 19) The method of claim 19, wherein the optical sensing device comprises an imaging sensor, and the imaging sensor is a charge-coupled device image sensor or a complementary metal-oxide semiconductor sensor. ### Claim 21 (depends on 14) The method of claim 14, further comprising the steps of: transferring stacked film frame assemblies waiting for inspection from a loading station to the support table assembly; and stacking inspected film frame assemblies in sequence to an unloading station.