# US 2010/0166291 A1 · Apparatus for measuring and calibrating error of wafer prober > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2010/0166291 A1 - Document ID: US20100166291A1 - Status: Published application - Kind: A1 - Application number: 12/664,011 - Filed: 2008-06-11 - Published: 2010-07-01 - Earliest claimed: 2007-06-11 - Assignees: Semics Inc. - Inventors: Jong-Guk Lee - Web page: https://patentgrep.com/patent/US20100166291A1 ## CPC - G05B 19/402: characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position (G05B19/19 takes precedence) - G01R 31/2891: {related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05)} - G05B 2219/37506: Correction of position error - G05B 2219/37555: Camera detects orientation, position workpiece, points of workpiece - G05B 2219/45031: Manufacturing semiconductor wafers - G05B: CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables G05D; systems for regulating electric or magnetic variables G05F; control devices or systems insofar as characterised by mechanical features only G05G) - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract Provided is an error measurement and correction device of a stage of a wafer prober. The error measurement and correction device includes a jig member, a vision module, a central processing unit, and an interface unit. The jig member is disposed on a chuck on the stage, and the vision module is disposed on an upper plate of the wafer prober disposed at a position facing the jig member to enable the camera of the vision module to acquire images of the patterns of the jig member and transmits the acquired images to the central processing unit. The central processing unit acquires images of the patterns of the jig member disposed on the chuck by using the vision module to extract reference position information, moves the stage at a unit interval of the pattern, acquires images of the patterns of the jig member again to extract measured position information, and generates and stores mapping data by calculating difference between the measured position information and the reference position information. The central processing unit corrects the movement position information on the stage to be moved by using the mapping data when the stage is moved, so that irrespective of physical deterioration of the stage, the stage can be moved to an accurate position. ## Claims ### Claim 1 An error measurement and correction device for measuring and correcting errors of a stage of a wafer prober, comprising: a jig member having a surface on which patterns having the same shape are repeatedly formed; a vision module having a base substrate and one or more cameras mounted on the base substrate; and a central processing unit acquiring one or more images of the patterns of the jig member by using the vision module, extracting errors of a position of the stage on which the jig member is disposed by using the images of the patterns received from the vision module, and correcting the position of the stage to be moved by using the errors and providing the corrected position to a control encoder of the stage, wherein the jig member is disposed on a chuck on the stage, and wherein the vision module is disposed on an upper plate of the wafer prober disposed at a position facing the chuck to enable the camera of the vision module to pick up the patterns of the jig member on the chuck and transmits the picked images to the central processing unit. ### Claim 2 (depends on 1) The error measurement and correction device of claim 1, wherein the central processing unit acquires images of the jig member disposed on the chuck from the vision module to extract reference position information by analyzing the acquired images, moves the stage at a unit interval of the pattern of the jig member, acquires images of the jig member again, extracts measured position information by analyzing the acquired images, generates mapping data by calculating differences between the reference position information and the measured position information, and stores the generated mapping data in a data storage unit. ### Claim 3 (depends on 2) The error measurement and correction device of claim 2, wherein, when the stage is to be moved, the central processing unit reads the mapping data from the data storage unit, corrects the movement position information on the stage by using the read mapping data, and moves the stage according to the corrected movement position information. ### Claim 4 (depends on 1) The error measurement and correction device of claim 1, wherein the jig member is a jig member in which a pattern having the same shape is repeatedly formed or a wafer in which pads having the same shape are repeatedly formed. ### Claim 5 (depends on 1) The error measurement and correction device of claim 1, wherein the vision module includes first and second vision modules mounted to the upper plate of the wafer prober, wherein the first vision module is mounted at a position at which a wafer camera is to be mounted on the upper plate of wafer prober, and wherein the second vision module is mounted at a position facing the chuck of the stage on the upper plate of the wafer prober. ### Claim 6 (depends on 1) The error measurement and correction device of claim 1, further comprising an interface unit disposed between the vision module and the central processing unit, wherein the interface unit drives a particular camera of the vision module according to an instruction received from the central processing unit or transmits images transmitted from the particular camera of the vision module to the central processing unit. ### Claim 7 An error measurement device for measuring errors of a stage of the wafer prober, comprising: a jig member having a surface on which patterns having the same shape are repeatedly formed; a vision module having a base substrate and one or more cameras mounted to the base substrate; and a central processing unit acquiring one or more images of the patterns of the jig member by using the vision module, extracting errors of a position of the stage on which the jig member is disposed by using the images of the patterns received from the vision module, and correcting the position of the stage to be moved by using the errors and providing the corrected position to a control encoder of the stage, wherein the jig member is disposed on a chuck on the stage, wherein the vision module is disposed on an upper plate of the wafer prober disposed at a position facing the chuck to enable the camera of the vision module to pick up the patterns of the jig member on the chuck and transmits the picked images to the central processing unit, and wherein the central processing unit acquires images of the jig member disposed on the chuck from the vision module to extract reference position information by analyzing the acquired images, moves the stage at a unit interval of the pattern of the jig member, acquires images of the jig member again, extracts measured position information by analyzing the acquired images, generates mapping data by calculating differences between the reference position information and the measured position information, and stores the generated mapping data in a data storage unit.