# US 2010/0165573 A1 · Heat sink used in interface card > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2010/0165573 A1 - Document ID: US20100165573A1 - Status: Published application - Kind: A1 - Application number: 12/347,035 - Filed: 2008-12-31 - Published: 2010-07-01 - Earliest claimed: 2008-12-31 - Assignees: Cooler Master Co., Ltd. - Inventors: Yuan-Cheng FANG - Web page: https://patentgrep.com/patent/US20100165573A1 ## CPC - G06F 1/20: Cooling means - H10W 40/43: by flowing gases, e.g. forced air cooling - H10W 40/73: for cooling by change of state - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A heat sink used in an interface card includes a supporting base, a first heat-dissipating body and a second heat-dissipating body. The supporting base has a side. The first heat-dissipating body is mounted on the supporting base. The first heat-dissipating body is constituted of a plurality of overlapping heat-dissipating pieces. The heat-dissipating pieces are arranged obliquely with respect to the side. The second heat-dissipating body overlaps on the first heat-dissipating body. The second heat-dissipating body comprises a plurality of heat-dissipating pieces. Via the above arrangement, the heat-dissipating efficiency of the interface card can be increased and the lifetime thereof can be extended. ## Claims ### Claim 1 A heat sink used in an interface card, comprising: a supporting base having a side; a first heat-dissipating body mounted on the supporting base, the first heat-dissipating body being constituted of a plurality of heat-dissipating pieces, the heat-dissipating pieces being arranged obliquely with respect to the side; and a second heat-dissipating body overlapping on the first heat-dissipating body, the second heat-dissipating body comprising a plurality of heat-dissipating pieces. ### Claim 2 (depends on 1) The heat sink used in an interface card according to claim 1, wherein the heat-dissipating pieces of the second heat-dissipating body are arranged to be parallel to the side. ### Claim 3 (depends on 1) The heat sink used in an interface card according to claim 1, further comprising a fan mounted to the supporting base and located beside the first heat-dissipating body and the second heat-dissipating body. ### Claim 4 (depends on 3) The heat sink used in an interface card according to claim 3, wherein the fan is a centrifugal fan or an axial fan. ### Claim 5 (depends on 3) The heat sink used in an interface card according to claim 3, further comprising a wind cover connected to the supporting base, the wind cover covering the first heat-dissipating body, the second heat-dissipating body and the fan. ### Claim 6 (depends on 5) The heat sink used in an interface card according to claim 5, wherein the wind cover is provided with an intake port corresponding to the fan and an exit port provided on one side of the wind cover. ### Claim 7 (depends on 3) The heat sink used in an interface card according to claim 3, wherein the supporting base comprises a fixing plate and a heat-conducting block fixedly inserted into the fixing plate. ### Claim 8 (depends on 7) The heat sink used in an interface card according to claim 7, wherein the heat-conducting block is adhered to the first heat-dissipating body. ### Claim 9 (depends on 7) The heat sink used in an interface card according to claim 7, wherein the heat-conducting block is a copper block or an aluminum block. ### Claim 10 (depends on 7) The heat sink used in an interface card according to claim 7, wherein the supporting base further comprises at least one bolt protruding from the fixing plate, the fan is provided with at least one through-hole, at least one screw passes through the through-hole to lock the fan. ### Claim 11 A heat sink used in an interface card, comprising: a supporting base having a side; a first heat-dissipating body mounted on the supporting base, the first heat-dissipating body being constituted of a plurality of heat-dissipating pieces, the heat-dissipating pieces being arranged obliquely with respect to the side; a second heat-dissipating body overlapping on the first heat-dissipating body, the second heat-dissipating body comprising a plurality of heat-dissipating pieces; and at least one heat pipe having an evaporator section sandwiched between the supporting base and the first heat-dissipating body as well as a condenser section extending from the evaporator section and connected to the second heat-dissipating body. ### Claim 12 (depends on 11) The heat sink used in an interface card according to claim 11, wherein the heat-dissipating pieces of the second heat-dissipating body are arranged to be parallel to the side. ### Claim 13 (depends on 11) The heat sink used in an interface card according to claim 11, further comprising a fan mounted to the supporting base and located beside the first heat-dissipating body and the second heat-dissipating body. ### Claim 14 (depends on 13) The heat sink used in an interface card according to claim 13, wherein the fan is a centrifugal fan or an axial fan. ### Claim 15 (depends on 13) The heat sink used in an interface card according to claim 13, further comprising a wind cover connected to the supporting base, the wind cover covering the first heat-dissipating body, the second heat-dissipating body and the fan. ### Claim 16 (depends on 15) The heat sink used in an interface card according to claim 15, wherein the wind cover is provided with an intake port corresponding to the fan and an exit port provided on one side of the wind cover. ### Claim 17 (depends on 13) The heat sink used in an interface card according to claim 13, wherein the supporting base comprises a fixing plate and a heat-conducting block fixedly inserted into the fixing plate. ### Claim 18 (depends on 17) The heat sink used in an interface card according to claim 17, wherein the second heat-dissipating body is provided with a trough for allowing the condenser section to be inserted therein, the evaporator section is sandwiched between the first heat-dissipating body and the heat-conducting block. ### Claim 19 (depends on 17) The heat sink used in an interface card according to claim 17, wherein the heat-conducting block is a copper block or an aluminum block. ### Claim 20 (depends on 17) The heat sink used in an interface card according to claim 17, wherein the supporting base further comprises at least one bolt protruding from the fixing plate, the fan is provided with at least one through-hole corresponding to the bolt, at least one screw passes through the through-hole to lock the fan. ### Claim 21 (depends on 11) The heat sink used in an interface card according to claim 11, wherein the heat pipe is a U-shaped heat pipe. ### Claim 22 (depends on 11) The heat sink used in an interface card according to claim 11, wherein the cross section of the heat pipe is rectangular. ### Claim 23 (depends on 17) The heat sink used in an interface card according to claim 17, further comprising at least one heat-conducting pipe, the heat-conducting pipe having a heated section sandwiched between the supporting base and the first heat-dissipating body as well as a heat-releasing section. ### Claim 24 (depends on 23) The heat sink used in an interface card according to claim 23, wherein the fixing plate is provided with a trough for allowing the heat-releasing section to be inserted therein, the heated section is adhered to the heat-conducting block. ### Claim 25 (depends on 23) The heat sink used in an interface card according to claim 23, wherein the heat-conducting pipe is a U-shaped heat pipe. ### Claim 26 (depends on 23) The heat sink used in an interface card according to claim 23, wherein the cross section of the heat-conducting pipe is rectangular.