# US 2010/0165185 A1 · Circuit board assembly

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- Number: US 2010/0165185 A1
- Document ID: US20100165185A1
- Status: Published application
- Kind: A1
- Application number: 12/719,942
- Filed: 2010-03-09
- Published: 2010-07-01
- Earliest claimed: 2007-04-27
- Assignees: Hon Hai Precision Industry Co., Ltd.
- Inventors: FU-YEN TSENG
- Web page: https://patentgrep.com/patent/US20100165185A1

## CPC

- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 3/3421: {Leaded components}
- H05K 3/363: {by soldering}
- H05K 3/321: by conductive adhesives
- H05K 2201/09063: Holes or slots in insulating substrate not used for electrical connections
- H05K 2201/09472: Recessed pad for surface mounting; Recessed electrode of component
- H05K 2201/09745: Recess in conductor, e.g. in pad or in metallic substrate
- H05K 2203/1178: Means for venting or for letting gases escape
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A circuit board assembly includes a circuit board and at least one electrical element. The circuit board includes a dielectric substrate including a supporting surface, and at least one connecting part formed on the supporting surface. The at least one electrical element is electrically connected to the at least one connecting part via a connecting media. At least one air-exhaust hole extends through the connecting part and the dielectric substrate. The at least one air-exhaust hole is configured for exhausting air from the connecting media.

## Claims

### Claim 1

A circuit board assembly comprising:
a first circuit board, the first circuit board comprising a first dielectric substrate and at least one first connecting part forming on the first dielectric substrate;
a second circuit board comprising a second dielectric substrate and at least one second connecting part, the second dielectric substrate comprising a supporting surface, the at least one second connecting part being formed on the supporting surface, facing the at least one first connecting part, and electrically connecting to the at least one first connecting part via a connecting media, wherein the at least one second connecting part defines at least one air-exhaust hole extending through the at least one second connecting part and the second dielectric substrate, to exhaust air from the connecting media.

### Claim 2 (depends on 1)

The circuit board assembly as claimed in claim 1, further comprising an electrical element electrically connected to the first circuit board.

### Claim 3 (depends on 2)

The circuit board assembly as claimed in claim 2, wherein the electrical element is a camera module comprising an image chip electrically connected to the first circuit board.

### Claim 4 (depends on 3)

The circuit board assembly as claimed in claim 3, wherein the camera module further comprises a holder with at least one lens and the image chip received therein; the image chip is electrically connected to the first connecting part via the connecting media.

### Claim 5 (depends on 4)

The circuit board assembly as claimed in claim 4, wherein the holder is installed on the first circuit board.

### Claim 6 (depends on 1)

The circuit board assembly as claimed in claim 1, wherein the first dielectric substrate defines a first cavity facing the second dielectric substrate, and a first electrical connecting part is formed in the first cavity.

### Claim 7 (depends on 6)

The circuit board assembly as claimed in claim 6, wherein the supporting surface of the second dielectric substrate defines a second cavity and a second electrical connecting part formed in the second cavity; the connecting media is disposed between the first electrical connecting part and the second electrical connecting part.