# US 2010/0165183 A1 · Camera module

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- Number: US 2010/0165183 A1
- Document ID: US20100165183A1
- Status: Published application
- Kind: A1
- Application number: 12/406,944
- Filed: 2009-03-18
- Published: 2010-07-01
- Earliest claimed: 2008-12-26
- Assignees: Premier Image Technology(China) Ltd.; Hon Hai Precision Industry Co., Ltd.
- Inventors: Jia-Jun Tian
- Web page: https://patentgrep.com/patent/US20100165183A1

## CPC

- H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof
- H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION

## Abstract

An camera module includes a substrate, an image sensor chip, and a lens module. The image sensor chip is disposed on and electrically connected to the substrate. The lens module is mounted on the base via an adhesive layer. The lens module includes a bottom surface contacting with the substrate. The bottom surface defines at least one sloped surfaces thereon. At least one gap is defined between the substrate and the at least one sloped surface. The adhesive layer is disposed between the bottom surface and the substrate, the gap is capable of accepting adhesive when the lens module and substrate are pressed together.

## Claims

### Claim 1

An camera module comprising:
a substrate;
an image sensor chip disposed on and electrically connected to the substrate;
a lens module mounted on the substrate via an adhesive layer, the lens module comprising:
a bottom surface contacting with the substrate, the bottom surface defining at least one sloped surface, wherein at least one gap is defined between the substrate and the at least one sloped surface, the adhesive layer being disposed between the bottom surface and the substrate; the gap is capable of accepting adhesive when the lens module and the substrate are pressed together.

### Claim 2 (depends on 1)

The camera module as claimed in claim 1, wherein the lens module further comprises a outer sidewall, the at least one sloped surface extending from the bottom surface to the outer sidewall.

### Claim 3 (depends on 1)

The camera module as claimed in claim 1, wherein the lens module further comprises a inner sidewall, the sloped surface extending from the bottom surface to the inner sidewall.

### Claim 4 (depends on 1)

The camera module as claimed in claim 1, wherein the gap is triangular, or a trapeziform in shape.

### Claim 5 (depends on 1)

The camera module as claimed in claim 1, wherein the profile of the bottom surface is “V” in shape.

### Claim 6 (depends on 1)

The camera module as claimed in claim 1, wherein the lens module further comprises an inner sidewall and an outer sidewall, the bottom surface defines an inner sloped surface extending from the bottom surface to the inner sidewall, and an outer sloped surfaces extending from the bottom surface to the outer sidewall, a first gap is defined between the substrate and the inner sloped surface, a second gap is defined between the substrate and the outer sloped surface.

### Claim 7 (depends on 1)

The camera module as claimed in claim 1, wherein the image sensor chip comprises a photosensitive area on the substrate, and a non-photosensitive area surrounding the photosensitive area, the non-photosensitive area comprises a number of chip pads, the substrate comprises a plurality of base pads, each base pad is electrically connected to a corresponding chip pad via a conductive wire.

### Claim 8 (depends on 1)

The camera module as claimed in claim 1, wherein the image sensor chip is mechanically and electrically connected to the substrate by chip-scale, wafer-level chip-scale, ceramic leaded, plastic leadless chip, thermal compression bonding, or a flip chip packaging processes.

### Claim 9 (depends on 1)

The camera module as claimed in claim 1, wherein the lens module comprises a lens holder, the lens holder comprises a top hollow cylinder and a bottom hollow cylinder, the bottom surface is located on the bottom hollow cylinder and the image sensor chip is received in the bottom hollow cylinder.

### Claim 10 (depends on 9)

The camera module as claimed in claim 9, wherein the lens module further comprises a lens barrel and a lens group received in the lens barrel, the combined lens barrel and lens group are received in the top hollow cylinder.

### Claim 11 (depends on 10)

The camera module as claimed in claim 10, further comprising a transparent, the lens barrel comprising a lower surface facing the image sensor chip, wherein the transparent cover is provided between the image sensor chip and the lens group.

### Claim 12 (depends on 11)

The camera module as claimed in claim 11, wherein the transparent cover is an infrared filter.

### Claim 13 (depends on 11)

The camera module as claimed in claim 11, wherein the transparent cover is directly fixed to the lens module.

### Claim 14 (depends on 11)

The camera module as claimed in claim 11, wherein the lens holder further comprises a connecting plate connecting the top hollow cylinder and the bottom hollow cylinder, the transparent cover is fixed to the inner surface of the connecting plate.