# US 2010/0164783 A1 · Platform Integrated Phased Array Transmit/Receive Module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2010/0164783 A1 - Document ID: US20100164783A1 - Status: Published application - Kind: A1 - Application number: 12/347,316 - Filed: 2008-12-31 - Published: 2010-07-01 - Earliest claimed: 2008-12-31 - Assignees: Intel Corporation - Inventors: Debabani Choudhury; Richard S. Perry - Web page: https://patentgrep.com/patent/US20100164783A1 ## CPC - H01Q 3/26: varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture ({H01Q3/12,} H01Q3/22, H01Q3/24 take precedence) - H01Q 1/02: Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} - H01Q 21/0025: {Modular arrays} - H01Q 21/065: {Patch antenna array} - H01Q 23/00: Antennas with active circuits or circuit elements integrated within them or attached to them - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Disclosed are integration approaches for mm-wave planar phased array type architectures using multilayer substrate technologies. For instance, an apparatus may include a plurality of substrate layers, an integrated circuit, and a connector module. The plurality of substrate layers includes a first substrate layer having one or more phased array elements. The integrated circuit exchange one or more radio frequency (RF) signals (e.g., mm-wave signals) with the one or more phased array elements. The connector module exchange further signals with the integrated circuit that correspond to the one or more RF signals. For example, these further signals may be baseband or intermediate frequency (IF) signals. ## Claims ### Claim 1 An apparatus, comprising: a plurality of substrate layers, the plurality of substrate layers including a first substrate layer having one or more phased array elements; an integrated circuit to exchange one or more radio frequency (RF) signals with the one or more phased array elements; and a connector module to exchange one or more further signals with the integrated circuit, the one or more further signals corresponding to the one or more RF signals. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the plurality of substrate layers includes a second substrate layer; and wherein the integrated circuit and the connector module are adjacent to the second layer. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the plurality of substrate layers includes one or more substrate layers between the first substrate layer and the second substrate layer. ### Claim 4 (depends on 1) The apparatus of claim 1, further comprising a heat sink layer adjacent and abutting the second substrate layer; wherein the connection module is located in a first recess within the heat sink layer; and wherein the integrated circuit is located in a second recess provided by heat sink layer ### Claim 5 (depends on 4) The apparatus of claim 4, further comprising a heat spreader element located within the heat sink layer, wherein the heat spreader element is positioned in alignment with the integrated circuit. ### Claim 6 (depends on 4) The apparatus of claim 4, wherein the integrated circuit is attached to the heat signal layer by a conductive paste material. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein the one or more RF signals are each millimeter-wave signals. ### Claim 8 (depends on 1) The apparatus of claim 1, wherein the connector module is configured to receive a cable having one or more conductors, the cable to convey the further signal. ### Claim 9 (depends on 1) The apparatus of claim 1, further comprising the cable. ### Claim 10 An apparatus, comprising a host module; and a phased array transmit and receive module wherein the phased array transmit and receive module includes: a plurality of substrate layers, the plurality of substrate layers including a first substrate layer having one or more phased array elements, an integrated circuit to exchange one or more radio frequency (RF) signals with the one or more phased array elements, and a connector module to exchange one or more further signals with the integrated circuit, the one or more further signals corresponding to the one or more RF signals; wherein the host module is to exchange the further signals with the connector module through a cable. ### Claim 11 (depends on 10) The apparatus of claim 10, wherein the plurality of substrate layers includes a second substrate layer; and wherein the integrated circuit and the connector module are adjacent to the second layer. ### Claim 12 (depends on 10) The apparatus of claim 10, wherein the plurality of substrate layers includes one or more substrate layers between the first substrate layer and the second substrate layer. ### Claim 13 (depends on 10) The apparatus of claim 10, further comprising a heat sink layer adjacent and abutting the second substrate layer; wherein the connection module is located in a first recess within the heat sink layer; and wherein the integrated circuit is located in a second recess provided by heat sink layer ### Claim 14 (depends on 13) The apparatus of claim 13, further comprising a heat spreader element located within the heat sink layer, wherein the heat spreader element is positioned in alignment with the integrated circuit. ### Claim 15 (depends on 13) The apparatus of claim 13, wherein the integrated circuit is attached to the heat signal layer by a conductive paste material. ### Claim 16 (depends on 10) The apparatus of claim 10, wherein the one or more RF signals are each millimeter-wave signals. ### Claim 17 (depends on 10) The apparatus of claim 10, further comprising the cable. ### Claim 18 (depends on 10) The apparatus of claim 10, wherein the cable is a flexible cable. ### Claim 19 (depends on 10) The apparatus of claim 10, wherein the one or more further signals includes an intermediate frequency (IF) signal. ### Claim 20 (depends on 10) The apparatus of claim 10, wherein the one or more further signals includes a baseband signal.