# US 2010/0164601 A1 · Control circuit for a power semiconductor assembly and power semiconductor assembly > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2010/0164601 A1 - Document ID: US20100164601A1 - Status: Published application - Kind: A1 - Application number: 12/646,112 - Filed: 2009-12-23 - Published: 2010-07-01 - Earliest claimed: 2008-12-23 - Assignees: Infineon Technologies AG - Inventors: Uwe Jansen - Web page: https://patentgrep.com/patent/US20100164601A1 ## CPC - H02M 1/088: for the simultaneous control of series or parallel connected semiconductor devices - H02M 1/08: Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters - H03K 17/127: {in composite switches} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/753: {between laterally-adjacent chips} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) - H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Disclosed is a control circuit for controlling a controllable power semiconductor switch, and to a power semiconductor module. The control circuit comprises at least two circuit sets, each having a power driver. The power driver of each of the circuit sets is provided with power via impedance components having an impedance other than zero. ## Claims ### Claim 1 A control circuit comprising a control logic with at least two outputs each capable of providing a first control signal for controlling a controllable power semiconductor switch; at least two circuit sets, precisely one each of which is assigned one of the outputs of the control logic and each of which comprises an input which is coupled/coupleable electrically to the output of the control logic assigned to the corresponding circuit sets; each of the circuit sets comprising: a power driver assigned to each circuit set which is coupled/coupleable electrically at the input side to the input of the corresponding circuit set; a power supply connection set comprising at least two terminals which is coupled/coupleable electrically to precisely one of the power driver of the corresponding circuit set to connect the corresponding power driver to a voltage source for application to the corresponding circuit sets; a signal common output and signal output for controlling a controllable power semiconductor switch; wherein each of the at least two terminals of the circuit sets is or may be connected electrically by using an impedance component to the power driver of the power supply connection set assigned to the corresponding power supply connection set, each impedance component comprising an impedance other than zero having an effective resistance and/or a reactance; wherein in each of the circuit sets one of the impedance components of the respective circuit set is connected, on its side facing the power driver of the respective circuit set, directly to the signal common output of the respective circuit set; each of the other impedance components of the respective circuit set is connected, on its side facing the power driver of the respective circuit set, via a capacitor to the signal common output of the respective circuit set; and the power for supplying the complete power driver of the respective circuit set is supplied via the impedance components of the respective circuit set only. ### Claim 2 (depends on 1) The control circuit of claim 1 wherein for none of the impedance components the magnitude of the impedance is determined mainly by circuiting the conductor tracks of a substrate and/or bond wires and/or contact pads. ### Claim 3 (depends on 1) The control circuit of claim 1, wherein precisely one, several or each of the impedance components comprises an ohmic resistance and/or an inductance. ### Claim 4 (depends on 1) The control circuit of claim 1 wherein at least one of the impedance components comprises a coil. ### Claim 5 (depends on 1) The control circuit of claim 1 wherein the impedance components of a circuit set comprise windings on a common coil core forming together therewith a common mode choke. ### Claim 6 (depends on 1) The control circuit of claim 1 wherein in precisely one, several or each of the circuit sets the corresponding power supply connection set each comprises precisely two terminals for connecting a unipolar power supply. ### Claim 7 (depends on 6) The control circuit of claim 6 wherein in the power supply connection set comprising precisely one, several or each of the precisely two terminals for connecting a unipolar power supply the impedance components assigned to the corresponding power supply connection set are coupled by using at least one buffer capacitor at their sides connected facing the power driver of the corresponding circuit set. ### Claim 8 (depends on 1) The control circuit of claim 1 wherein in precisely one, several or each of the circuit sets the corresponding power supply connection set comprises three terminals for connecting a bipolar power supply of which a first terminal is provided to connect a reference potential, a second terminal to connect a negative potential below the reference potential and a third terminal to connect a positive potential above the reference potential. ### Claim 9 (depends on 8) The control circuit of claim 8 wherein in precisely one, several or each of the power supply connection sets comprising three terminals for connecting a bipolar power supply of the impedance components assigned to the corresponding power supply connection set, the impedance component coupled to the terminal for the reference potential at the their side connected facing the power driver of the corresponding circuit set being coupled by using at least one buffer capacitor to the sides of the other impedance components of the corresponding circuit set connected facing the power driver of the corresponding circuit set. ### Claim 10 (depends on 1) The control circuit of claim 1 wherein one, several or each of the power drivers comprises an emitter follower with complementary bipolar transistors. ### Claim 11 (depends on 1) The control circuit of claim 1 wherein one, several or each of the power drivers comprises a source follower with two complementary MOSFETs. ### Claim 12 (depends on 1) The control circuit of claim 1 wherein one, more or each of the power drivers comprises an output stage with an inverting CMOS transistor stage. ### Claim 13 (depends on 1) The control circuit of claim 1 wherein any optional terminal of an optional power supply connection set is electrically conductively connected/connectable to one terminal each of any of the other power supply connection sets. ### Claim 14 (depends on 1) The control circuit of claim 1 wherein at least the control logic and the power drivers are arranged on a common substrate. ### Claim 15 (depends on 1) The control circuit of claim 1 wherein the power driver of each of the circuit sets comprises an output stage, the power supply of which is provided via the impedance components of the respective circuit set. ### Claim 16 A power semiconductor assembly including a control circuit, and a number of controllable power semiconductor switches which corresponds to the number of circuit sets, the control circuit comprising: a control logic with at least two outputs each capable of providing a first control signal for controlling a controllable power semiconductor switch; at least two circuit sets, precisely one each of which is assigned one of the outputs of the control logic and each of which comprises an input which is coupled/coupleable electrically to the output of the control logic assigned to the corresponding circuit sets; each of the circuit sets comprising: a power driver assigned to each circuit set which is coupled/coupleable electrically at the input side to the input of the corresponding circuit set; a power supply connection set comprising at least two contacts which is coupled/coupleable electrically to precisely one of the power driver of the corresponding circuit set to connect the corresponding power driver to a voltage source for application to the corresponding circuit sets; a signal common output and signal output for controlling a controllable power semiconductor switch; wherein each of the at least two contacts of the circuit sets is or may be connected electrically by using an impedance component to the power driver of the power supply connection set assigned to the corresponding power supply connection set, each impedance component comprising an impedance other than zero having an effective resistance and/or a reactance; wherein in each of the circuit sets one of the impedance components of the respective circuit set is connected, on its side facing the power driver of the respective circuit set, directly to the signal common output of the respective circuit set; each of the other impedance components of the respective circuit set is connected, on its side facing the power driver of the respective circuit set, via a capacitor to the signal common output of the respective circuit set; and the power for supplying the complete power driver of the respective circuit set is supplied via the impedance components of the respective circuit set; and each of the controllable power semiconductor switches comprising a first load contact, a second load contact and a control contact wherein configured between the first load contact and the second load contact in each case is a load path which may be switched in an electrically conductive ON-state or in an electrically blocking OFF-state by using the corresponding control contact and each of the control contacts of precisely one of the controllable power semiconductor switches is coupled/coupleable electrically to an output of the power driver of precisely one of the circuit sets. ### Claim 17 (depends on 16) The power semiconductor assembly of claim 16 wherein for one, several or each of the circuit sets the magnitude of the impedance of one, several or all impedance components of the corresponding circuit sets is greater than 0.3 times the gate resistance for controlling the controllable power semiconductor switches which is coupled/coupleable to the output of the power driver of the corresponding circuit set, the gate resistance being given by the gate resistance in the coupled condition when the controllable power semiconductor switches may be coupled, and the gate resistance in case the controllable power semiconductor switch is achieved by using a sole power semiconductor chip is given by the total resistance from the output of the power driver of the corresponding circuit set to a control contact of the power semiconductor chip; the gate resistance in case the controllable power semiconductor switch is achieved by at least two power semiconductor chips electrically connected in parallel is given by the resistance resulting from electrically circuiting in parallel all total resistances from the output of the power driver of the corresponding circuit set up to a control contact of each of the power semiconductor chips connected in parallel; the magnitude of the impedance for a frequency-dependent impedance component is defined as the magnitude of the impedance which the impedance component exhibits at the frequency at which the current through the output of the power driver belonging to the same circuit set as the impedance component features in its Fourier spectrum the largest amplitude by magnitude when the input of the corresponding power driver is connected to a square-wave control voltage. ### Claim 18 (depends on 17) The power semiconductor assembly of claim 17 wherein in at least one of the circuit sets in all impedance components of the corresponding circuit set the magnitude of the impedance is greater than 0.3 times the resistance of the control contact which is coupled/coupleable to the output of the power driver of said circuit set. ### Claim 19 (depends on 17) The power semiconductor assembly as set forth in claim 17 wherein the control contacts of the controllable power semiconductor switches are configured as gate contacts and in which the resistances of the control contacts are the gate resistances of the corresponding controllable power semiconductor switches. ### Claim 20 (depends on 19) The power semiconductor assembly of claim 19 wherein each controllable power semiconductor switch is achieved either by using precisely one semiconductor chip or by using at least two semiconductor chips connected in parallel, the gate resistance in the case of at least two semiconductor chips connected in parallel being given by the total gate resistance of the parallel circuit. ### Claim 21 (depends on 16) The power semiconductor assembly of claim 16 wherein the at least two terminals of the power supply connection set of each circuit set are connected to a common voltage source. ### Claim 22 (depends on 16) The power semiconductor assembly of claim 16 wherein the load path of precisely one, several or each of the at least two controllable power semiconductor switches is connected in series with a load path of each further power semiconductor switch. ### Claim 23 (depends on 22) The power semiconductor assembly of claim 22 wherein in precisely one, several or each of the pairs of the further power semiconductor switches and the controllable power semiconductor switches of the at least two controllable power semiconductor switches are connected to different voltage sources. ### Claim 24 (depends on 16) The power semiconductor assembly of claim 16 wherein the load paths of precisely two, more than two or each of the at least two controllable power semiconductor switches are electrically connected in parallel. ### Claim 25 (depends on 24) The power semiconductor assembly of claim 24 wherein the control contacts of the controllable power semiconductor switches electrically connected in parallel are coupled/coupleable to the same output of a common control logic.