# US 2010/0164085 A1 · Multi-die building block for stacked-die package

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- Number: US 2010/0164085 A1
- Document ID: US20100164085A1
- Status: Published application
- Kind: A1
- Application number: 12/347,738
- Filed: 2008-12-31
- Published: 2010-07-01
- Earliest claimed: 2008-12-31
- Assignees: Micron Technology, Inc.
- Inventors: Ravikumar Adimula; Myung Jin Yim
- Web page: https://patentgrep.com/patent/US20100164085A1

## CPC

- H10W 70/688: {Flexible insulating substrates}
- H10W 70/611: {for connecting multiple chips together}
- H10W 72/077: {Connecting of TAB connectors}
- H10W 72/701: {Tape-automated bond [TAB] connectors}
- H10W 90/00: Package configurations
- H10W 72/60: Strap connectors, e.g. thick copper clips for grounding of power devices
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 90/22: the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A multi-die building block for a stacked-die package is described. The multi-die building block includes a flex tape having a first surface and a second surface, each surface including a plurality of electrical traces. A first die is coupled, through a first plurality of interconnects, to the plurality of electrical traces of the first surface of the flex tape. A second die is coupled, through a second plurality of interconnects, to the plurality of electrical traces of the second surface of the flex tape.

## Claims

### Claim 1

A multi-die building block for a stacked-die package, comprising:
a flex tape having a first surface and a second surface, each surface comprising a plurality of electrical traces;
a first die coupled, through a first plurality of interconnects, to the plurality of electrical traces of the first surface of the flex tape; and
a second die coupled, through a second plurality of interconnects, to the plurality of electrical traces of the second surface of the flex tape.

### Claim 2 (depends on 1)

The multi-die building block of claim 1, wherein the flex tape comprises a polyimide material and the pluralities of electrical traces comprise copper.

### Claim 3 (depends on 2)

The multi-die building block of claim 2, wherein the flex tape has a thickness between the first and second die, the thickness approximately in the range of 15 -75 microns, and wherein each of the pluralities of electrical traces has a thickness between the first and second die, the thickness approximately in the range of 10-20 microns.

### Claim 4 (depends on 1)

The multi-die building block of claim 1, wherein each of the pluralities of interconnects comprises an array of metal bumps, and an electrically conductive adhesive is interspersed between each metal bump.

### Claim 5 (depends on 4)

The multi-die building block of claim 4, wherein the electrically conductive adhesive is an anisotropically conductive adhesive.

### Claim 6 (depends on 4)

The multi-die building block of claim 4, wherein each metal bump of each of the arrays of metal bumps comprises a metal selected from the group consisting of copper, gold, and nickel.

### Claim 7

A semiconductor package, comprising:
a substrate;
a stacked plurality of multi-die building blocks coupled to a surface of the substrate, each multi-die building block comprising:
a flex tape having a first surface and a second surface, each surface comprising a plurality of electrical traces;
a first die coupled, through a first plurality of interconnects, to the plurality of electrical traces of the first surface of the flex tape; and
a second die coupled, through a second plurality of interconnects, to the plurality of electrical traces of the second surface of the flex tape; and
a molding disposed above the substrate and encapsulating the stacked plurality of multi-die building blocks.

### Claim 8 (depends on 7)

The semiconductor package of claim 7, wherein an end of the flex tape of each multi-die building block is coupled to the surface of the substrate by an electrically conductive adhesive.

### Claim 9 (depends on 7)

The semiconductor package of claim 7, further comprising:
an array of solder bumps on a second surface of the substrate, wherein the semiconductor package is a ball-grid array (BGA) package.

### Claim 10 (depends on 7)

The semiconductor package of claim 7, wherein the flex tape of each multi-die building block comprises a polyimide material and the pluralities of electrical traces of each multi-die building block comprise copper.

### Claim 11 (depends on 10)

The semiconductor package of claim 10, wherein the flex tape of each multi-die building block has a thickness between the first and second die of each multi-die building block, the thickness approximately in the range of 15-75 microns, and wherein each of the pluralities of electrical traces of each multi-die building block has a thickness between the first and second die of each multi-die building block, the thickness approximately in the range of 10-20 microns.

### Claim 12 (depends on 7)

The semiconductor package of claim 7, wherein each of the pluralities of interconnects of each multi-die building block comprises an array of metal bumps, and an electrically conductive adhesive is interspersed between each metal bump.

### Claim 13 (depends on 12)

The semiconductor package of claim 12, wherein the electrically conductive adhesive is an anisotropically conductive adhesive.

### Claim 14 (depends on 12)

The semiconductor package of claim 12, wherein each metal bump of each of the arrays of metal bumps comprises a metal selected from the group consisting of copper, gold, and nickel.

### Claim at position 15

15-23. (canceled)