# US 2010/0164081 A1 · Micro-Optical Device Packaging System > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2010/0164081 A1 - Document ID: US20100164081A1 - Status: Published application - Kind: A1 - Application number: 12/345,421 - Filed: 2008-12-29 - Published: 2010-07-01 - Earliest claimed: 2008-12-29 - Assignees: Texas Instruments Incorporated - Inventors: Bradley Morgan Haskett; John Patrick O'Connor; Mark Myron Miller; Sean Timothy Crowley; Jeffery Alan Miks; Mark Phillip Popovich - Web page: https://patentgrep.com/patent/US20100164081A1 ## CPC - B81B 7/0067: {for controlling the passage of optical signals through the package} - B81B 7/007: {Interconnections between the MEMS and external electrical signals} - B81B 2201/042: Micromirrors, not used as optical switches - B81B 2207/07: Interconnects - B81C 2203/0109: Bonding an individual cap on the substrate - H10F 39/804: {Containers or encapsulations} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate. ## Claims ### Claim 1 A micro-optical device comprising: a digital micro-mirror device disposed on a surface of a substrate, the digital micro-mirror device having an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the digital micro-mirror device; a plurality of bonding wires that electrically couple the interconnect region to the surface of the substrate; and an annular frame attached to the surface and extending around an outer periphery of the window, the annular frame separated from the window by a gap that is less than 1000 microns in width, the annular frame and the digital micro-mirror device forming a cavity for placement of the plurality of bonding wires, the annular frame having a height approximately the same height as the window from the surface of the substrate and having an outer surface configured with one or more mechanical alignment features that are operable to couple an optical device to the electro-optical circuit at a predetermined position and orientation. ### Claim 2 A method for manufacturing a micro-optical device comprising: providing an electro-optical circuit having an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit; attaching the electro-optical circuit to a surface of a substrate; electrically connecting the substrate to the interconnect region; and partially enclosing the electro-optical circuit and the substrate with a structure that extends around and outer periphery of the window but is not affixed to the window. ### Claim 3 (depends on 2) The method of claim 2, wherein partially enclosing the electro-optical circuit with the structure comprises partially enclosing the electro-optical circuit with the structure externally to a clean-room environment. ### Claim 4 (depends on 2) The method of claim 2, further comprising filling a cavity between the structure and the electro-optical circuit with a potting material. ### Claim 5 (depends on 2) The method of claim 2, further comprising securing a lens housing to the structure. ### Claim 6 (depends on 5) The method of claim 5, further comprising maintaining the lens housing at a fixed position and orientation relative to the electro-optical circuit using one or mechanical alignment features configured on the structure. ### Claim 7 (depends on 2) The method of claim 2, wherein partially enclosing the electro-optical circuit with the structure comprises forming a gap between the structure and the window, the gap being less than 1000 microns. ### Claim 8 (depends on 2) The method of claim 2, wherein attaching the electro-optical circuit to the surface comprises attaching the electro-optical circuit to the surface externally to a clean-room environment. ### Claim 9 A micro-optical device comprising: an electro-optical circuit disposed on a surface of a substrate, the electro-optical circuit having an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit, a plurality of bonding wires that electrically couple the interconnect region to the substrate; and an annular frame attached to the surface and extending around an outer periphery of the window and separated from the window by a gap, the annular frame and the electro-optical circuit forming a cavity for placement of the plurality of bonding wires. ### Claim 10 (depends on 9) The micro-optical device of claim 9, wherein the annular frame is free of any mechanical bond to the window. ### Claim 11 (depends on 9) The micro-optical device of claim 9, wherein the gap is less than 1000 microns in width. ### Claim 12 (depends on 9) The micro-optical device of claim 9, wherein the window extends to a height from the surface of the substrate approximately the same height as the annular frame from the surface of the substrate. ### Claim 13 (depends on 9) The micro-optical device of claim 9, wherein the cavity is filled with a potting material. ### Claim 14 (depends on 9) The micro-optical device of claim 9, wherein the electro-optical circuit comprises a digital micro-mirror device (DMD). ### Claim 15 (depends on 9) The micro-optical device of claim 9, wherein the annular frame is made of plastic. ### Claim 16 (depends on 9) The micro-optical device of claim 9, wherein the annular frame comprises one or more alignment features that are operable to couple an optical device to the electro-optical circuit at a predetermined position and orientation. ### Claim 17 (depends on 16) The micro-optical device of claim 16, wherein the optical device comprises a lens.