# US 2010/0164047 A1 · Image sensor and method for manufacturing the same

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- Number: US 2010/0164047 A1
- Document ID: US20100164047A1
- Status: Published application
- Kind: A1
- Application number: 12/643,443
- Filed: 2009-12-21
- Published: 2010-07-01
- Earliest claimed: 2008-12-30
- Assignees: Dongbu HiTek Co., Ltd.
- Inventors: KI-JUN YUN
- Web page: https://patentgrep.com/patent/US20100164047A1

## CPC

- H10F 39/018: {of hybrid image sensors}
- H10F 39/811: {Interconnections}
- H10F 39/809: {of hybrid image sensors}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

## Abstract

An image sensor includes a semiconductor substrate, an interconnection and an interlayer dielectric, an image sensing device, a trench, a buffer layer, a barrier pattern, a via hole, and a metal contact. The semiconductor substrate includes a readout circuitry. The interconnection and an interlayer dielectric layer are formed on and/or over the semiconductor substrate while the interconnection is connected to the readout circuitry. The image sensing device may be formed on and/or over the interlayer dielectric and a trench may be formed in the image sensing device, the trench corresponding to the interconnection. The buffer layer may be formed on a sidewall of the trench. The barrier pattern may be formed on the buffer layer with the via hole penetrating through the image sensing device and the interlayer dielectric under the barrier pattern and exposing the interconnection. The metal contact may be formed in the via hole.

## Claims

### Claim 1

An apparatus comprising:
a semiconductor substrate comprising a readout circuitry;
an interconnection and an interlayer dielectric layer over the semiconductor substrate, the interconnection being connected to the readout circuitry;
an image sensing device over the interlayer dielectric;
a trench in the image sensing device, the trench corresponding to the interconnection;
a buffer layer on a sidewall of the trench;
a barrier pattern over the buffer layer, the barrier pattern selectively exposing a bottom surface of the trench;
a via hole penetrating through the image sensing device and the interlayer dielectric under the barrier pattern and exposing the interconnection; and
a metal contact in the via hole.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the image sensing device comprises a first doped layer, an intrinsic layer, and a second doped layer stacked therein, and the bottom surface of the trench exposes the first doped layer.

### Claim 3 (depends on 1)

The apparatus of claim 1, wherein the buffer layer is formed of a polymer.

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein the barrier pattern is formed of an Oxide-Nitride-Oxide (ONO) layer.

### Claim 5 (depends on 1)

The apparatus of claim 1, comprising:
the interconnection and the interlayer dielectric layer on the semiconductor substrate.

### Claim 6 (depends on 1)

The apparatus of claim 1, comprising:
the image sensing device on the interlayer dielectric.

### Claim 7 (depends on 1)

The apparatus of claim 1, comprising:
the barrier pattern on the buffer layer.

### Claim 8

A method, comprising:
forming a readout circuitry in a semiconductor substrate;
forming an interconnection and an interlayer dielectric over the semiconductor substrate, the interconnection being connected to the readout circuitry;
forming an image sensing device over the interlayer dielectric;
forming a mask on the image sensing device, the mask exposing the image sensing device corresponding to the interconnection;
forming a trench in the image sensing device using the mask as an etch mask;
forming a buffer layer on a sidewall of the trench;
forming a barrier pattern over the buffer layer;
forming a via hole exposing the interconnection using the barrier pattern; and
forming a metal contact in the via hole.

### Claim 9 (depends on 8)

The method of claim 8, wherein the forming of the trench and the buffer layer comprises:
forming a hard mask layer on the image sensing device;
forming a photoresist pattern on the hard mask layer, the photoresist pattern exposing the hard mask layer corresponding to the interconnection;
forming a hard mask selectively exposing the image sensing device using the photoresist pattern as an etch mask; and
etching the image sensing device using the photoresist pattern and the hard mask as an etch mask, and
the buffer layer is formed by attaching a polymer, which is a by-product generated in the forming of the trench, to the sidewall of the trench.
the buffer layer is formed by attaching a polymer to the sidewall of the trench.

### Claim 10 (depends on 9)

The method of claim 9, wherein the polymer is a by-product generated in the forming of the trench.

### Claim 11 (depends on 8)

The method of claim 8, wherein a bias voltage is applied in an etching process for forming the buffer layer.

### Claim 12 (depends on 8)

The method of claim 8, wherein the forming of the barrier pattern comprises:
forming a barrier layer over the image sensing device along a surface of the trench on which the buffer layer is formed; and
performing a blanket etching process on the barrier layer to expose an upper surface of the image sensing device and a bottom surface of the trench.

### Claim 13 (depends on 12)

The method of claim 12, wherein forming the barrier layer over the image sensing device comprises:
forming the barrier layer on the image sensing device along a surface of the trench on which the buffer layer is formed

### Claim 14 (depends on 8)

The method of claim 8, wherein the barrier pattern is formed of ONO layer.

### Claim 15 (depends on 8)

The method of claim 8, wherein the image sensing device comprises a first doped layer, an intrinsic layer, and a second doped layer stacked therein, and the bottom surface of the trench exposes the first doped layer.

### Claim 16 (depends on 8)

The method of claim 8, wherein an interconnection and an interlayer dielectric layer are formed on the semiconductor substrate.

### Claim 17 (depends on 8)

The method of claim 8, wherein the image sensing device is formed on the interlayer dielectric.

### Claim 18 (depends on 8)

The method of claim 8, wherein the barrier pattern is formed on the buffer layer.

### Claim 19 (depends on 8)

The method of claim 8, wherein forming the buffer layer includes using a polymer.

### Claim 20 (depends on 19)

The method of claim 19, wherein the polymer is generated in the forming of the trench.