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US 2010/0163913 A1Published application
Lamp and method of producing a lamp
AssigneeLednium Technology Pty Limited
InventorsBalu Jeganathan, John Albert Montagnat
Life of this patent
Estimating the term…
Abstract
A method of producing a lamp, including: mounting light emitting junctions in respective receptacles; mounting the receptacles on a curved support structure so as to form a three-dimensional array; and placing the light emitting junctions in electrical connection with the support structure.
Claims32
1-50. (canceled)
An LED packaging method, including:
- forming an electrically and thermally conductive receptacle having a substantially planar base and a substantially planar peripheral region;
- forming an electrical insulator on the peripheral region;
- forming an electrically conductive material on the electrical insulator;
- mounting a semiconductor die directly to the base within the receptacle, the die incorporating at least one light emitting diode (LED);
- and
- forming one or more electrical connections between the electrical electrically conductive material and one or more electrical contacts of the die to provide a packaged LED.
3 more elements
A packaged LED, including:
- an electrically and thermally conductive receptacle having a substantially planar base and a substantially planar peripheral region;
- an electrical insulator disposed on the peripheral region;
- an electrically conductive material disposed on the electrical insulator;
- a semiconductor die mounted directly to the base within the receptacle, the die incorporating at least one light emitting diode (LED);
- and
- one or more electrical connections between the electrical electrically conductive material and one or more electrical contacts of the die.
3 more elements
Dependencies are inferred from the claim text.