# US 2010/0163897 A1 · Flexible light source device and fabrication method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2010/0163897 A1 - Document ID: US20100163897A1 - Status: Published application - Kind: A1 - Application number: 12/422,291 - Filed: 2009-04-13 - Published: 2010-07-01 - Earliest claimed: 2008-12-26 - Assignees: Industrial Technology Research Institute - Inventors: Zhi-Cheng Hsiao; Chao-Kai Hsu; Yu-Hua Chen - Web page: https://patentgrep.com/patent/US20100163897A1 ## CPC - H05K 3/32: electrically connecting electric components or wires to printed circuits - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 2201/09481: Via in pad; Pad over filled via - H05K 2201/0969: Apertured conductors - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/2054: Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics - H05K 2203/1316: Moulded encapsulation of mounted components - H05K 2203/1469: Circuit made after mounting or encapsulation of the components - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A flexible light source device including a substrate, a light emitting device, a molding compound, a dielectric layer, and a metal line is provided. The substrate has a first surface, a second surface opposite to the first surface, and a first opening. The light emitting device is disposed on the first surface of the substrate and covers the first opening. The molding compound is located above the first surface and covers the light emitting device. The dielectric layer is disposed on the second surface and covers a sidewall of the first opening. The dielectric layer has a second opening which exposes part of the light emitting device. The metal line is disposed on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening in the dielectric layer. Additionally, a fabrication method of the flexible light source device is also provided. ## Claims ### Claim 1 A flexible light source device, comprising: a substrate, having a first surface and a second surface opposite to the first surface, wherein the substrate has a first opening; a light emitting device, disposed on the first surface of the substrate and covering the first opening; a molding compound, located above the first surface of the substrate and covering the light emitting device; a dielectric layer, disposed on the second surface of the substrate and covering a sidewall of the first opening, wherein the dielectric layer has a second opening which exposes a part of the light emitting device; and a metal line, disposed on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening in the dielectric layer. ### Claim 2 (depends on 1) The flexible light source device according to claim 1, wherein the molding compound comprises optical diffusing particles distributed therein. ### Claim 3 (depends on 1) The flexible light source device according to claim 1 further comprising a reflective film disposed between the substrate and the dielectric layer. ### Claim 4 (depends on 3) The flexible light source device according to claim 3, wherein the reflective film comprises a metal layer or a reflective material stack layer. ### Claim 5 (depends on 1) The flexible light source device according to claim 1 further comprising a heat conducting material which is disposed above the second surface of the substrate and covers the metal line. ### Claim 6 (depends on 5) The flexible light source device according to claim 5, wherein the heat conducting material comprises a metal film or a polymer composite material. ### Claim 7 (depends on 1) The flexible light source device according to claim 1 further comprising an optical film set disposed on the molding compound. ### Claim 8 (depends on 7) The flexible light source device according to claim 7, wherein the optical film set is directly attached to a surface of the molding compound. ### Claim 9 (depends on 7) The flexible light source device according to claim 7, wherein a difference of refractive index between the molding compound and the optical film set is smaller than or equal to 0.3. ### Claim 10 (depends on 7) The flexible light source device according to claim 7, wherein the optical film set comprises a diffuser, a brightness enhancement film, a prism sheet, or a combination thereof. ### Claim 11 (depends on 1) The flexible light source device according to claim 1, wherein the substrate is a flexible transparent substrate. ### Claim 12 (depends on 11) The flexible light source device according to claim 11, wherein a flexible radius of the flexible transparent substrate is greater than or equal to 5 cm. ### Claim 13 (depends on 11) The flexible light source device according to claim 11, wherein a material of the flexible transparent substrate is a polymer material. ### Claim 14 (depends on 1) The flexible light source device according to claim 1, wherein the light emitting device is a light emitting diode (LED). ### Claim 15 A fabrication method of a flexible light source device, comprising: providing a substrate, wherein the substrate has a first surface and a second surface opposite to the first surface; disposing a light emitting device on the first surface of the substrate; forming a molding compound on the first surface of the substrate to cover the light emitting device; forming a first opening on the second surface of the substrate, wherein the first opening exposes a part of the light emitting device; forming a dielectric layer on the second surface of the substrate, and filling the dielectric layer into the first opening; forming a second opening in the dielectric layer; and forming a metal line on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening. ### Claim 16 (depends on 15) The fabrication method according to claim 15, wherein the molding compound further comprises optical diffusing particles distributed therein. ### Claim 17 (depends on 15) The fabrication method according to claim 15, wherein before forming the dielectric layer, the fabrication method further comprises: forming a reflective film on the second surface of the substrate; and forming the first opening in the substrate and the reflective film. ### Claim 18 (depends on 15) The fabrication method according to claim 15, wherein after forming the metal line on the dielectric layer, the fabrication method further comprises attaching a heat conducting material above the second surface of the substrate and covering the metal line. ### Claim 19 (depends on 15) The fabrication method according to claim 15 further comprising forming an optical film set on the molding compound. ### Claim 20 (depends on 19) The fabrication method according to claim 19, wherein the optical film set is directly attached to a surface of the molding compound. ### Claim 21 (depends on 15) The fabrication method according to claim 15, wherein the light emitting device is disposed on the first surface of the substrate through a die bonding process.