Formation of low resistance damascene coils
AssigneeHitachi Global Storage Technologies Netherlands B.V.
InventorsDaniel Wayne Bedell, David Patrick Druist, Edward Hin Pong Lee, Jennifer Ai-Ming Loo, Vladimir Nikitin, Sue Siyang Zhang
Life of this patent
Estimating the term…
Abstract
In one embodiment and method of the present invention, a coil of a write head is created by forming a P1 pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.
Claims16
A method of forming a coil of a write head comprising:
- forming a P1 pedestal layer;
- forming a back gap layer;
- forming spacers using a non-damascene process;
- and
- forming a coil having coil turns disposed between the spacers using a damascene process.
A method of forming a coil, as recited in claim 2, further including the step of depositing a first non-magnetic material into a gap formed between the back gap layer and the P1 pedestal layer.
Dependencies are inferred from the claim text.